Zebra 1002 Carbon Connector connects printed circuit boards to LCD displays. Includes 240 alternating layers of conductive and nonconductive silicone per inch; can accommodate contact pad spacing as close as 0.015".
FX-942 dual-sided optical inspection system incorporates 12MP/5-axis inspection technology for top- and bottom-side applications, including solder ball, solder fillet quality, lead and pin, and foreign material inspection.
Alpha OM-550 HRL1 low temperature solder paste reportedly has SAC 305-type mechanical and thermal reliability.
NI-RFmx 2.2 measurement software for PXI RF test systems, when used with second-generation PXI Vector Signal Transceiver (VST), allows testing of 4.5G and 5G RF components such as transceivers and amplifiers using a wide range of carrier aggregation schemes, even as the 5G standard is still being defined.
REL61 lead-free solder alloy offers thermal cycling performance for such applications as LED lighting, in-cabin automotive electronics and high power applications. Reliability and performance characteristics equal to or greater than SAC 305 and other low/no-silver solder alloys. Mitigates tin whisker formation. Improves spread, flow and wetting versus low/no-silver alloys. Comes in bar, wire or paste.
AIM Solder
www.aimsolder.com/products/high-reliability-alloys
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