OM-535 is a low-temperature solder paste designed to enable a single reflow application for assembly of double-sided printed circuit boards. Has excellent no-solder drip during reflow. With SBX02 alloy and a melting point below 140°C, it has been used with peak reflow profiles between 155°C and 190°C. Flux residue provides excellent electrical resistivity. Eliminates extra wave or selective wave soldering process when temperature-sensitive through-hole components are used. Eliminates need for managing bar solder, wave soldering flux supplies, and pallets. Allows desired obsolescence of an extra SMT process.
Alpha, http://alpha.alent.com/
Has thermal conductivity of more than 10 BTU in/ft2•hr•°F with excellent electrical insulation properties. Is for potting, bonding, sealing and coating applications. Can be used in larger potting applications; has low exotherm when curing. Low coefficient of thermal expansion (CTE), enhanced dimensional stability, a high modulus and superior compressive strength properties.
Master Bond, www.masterbond.com
EP30P two-component epoxy offers adhesion to a variety of substrates. Suitable for bonding glass, polycarbonates and acrylics. Is an electrical insulator. Has low viscosity for encapsulating and potting. Produces high strength, rigid bonds resistant to water, oil, acids and many solvents.
Master Bond, www.masterbond.com
ezCLIP universal stop clip is for printed circuit board magazine racks. Distinguishes required spacing between boards; prevents damage on boards with taller components. Identifies which card guides should be skipped. Offers option for safely marking board spacing on PCB magazine racks for quick loading with proper component height tolerances. Available in single and double lane versions, both in packs of 50. Manufactured from spring steel and coated.
Count On Tools, www.cotinc.com
VP800 vapor phase soldering oven now features sensor-based profiling which sets the temperature profile to either linear or step profile. Monitors temperature measurement of each soldering cycle on the product level and the automatic control of the soldering profile. Temperature sensor is heated together with the solder product in the system and is used as a set point for the active process control. Enables simple creation of different product specific soldering profiles. Controls soldering profile according to the measured temperature data. Measures temperature profile for each soldering cycle. Records data for traceability and documentation. Detects nondestructive temperature and heating behaviors of the product. Enlarged 460 x 610mm process window optimizes process cycle time. Leaded assemblies can be processed with lead-free process fluid without exchange of the process fluid.
Asscon, http://www.asscon.de/e/
A-Tek Systems, http://www.atekllc.com/
Maxi fully automatic, customizable, self-contained aqueous cleaner is said to meet aerospace, automotive, and hydraulic industry cleanliness standards. Cleans large individual components or smaller components with high volumes. Cleaning chamber measures 24" x 24" x 32"; can be extended to 40". Single chamber rotational cleaning system features an ultrasonic wash and rinse, immersion wash and rinse, spray wash and rinse, hot air dry, and vacuum dry. Cleans without solvents or emissions. Can be configured with high-volume jet nozzles that penetrate and saturate the workload at a rate of 185 gal. per min. Provides full rotation of workload from 2 to 10 rpm. Total cycle times range from 3 to 20 min.
MecWash Systems, www.mecwash.com
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