Disposable material path TS5624DMP diaphragm valve reportedly enables difficult fluids and pre-mixed two-part epoxies to be dispensed without frequent cleaning. Wetted area can be replaced in seconds, while the valve stays on the production line. Wetted parts are manufactured from black Polyethylene to prevent moisture and UV light from coming into contact with the dispense fluids. Dispenses low to medium viscosity fluids over a range of shot and bead sizes, down to a fraction of a µl. Has internal spring return; valves adaptable for use with Techcon Systems controllers. Seal-less valve design offers moisture-sensitive resistance. Diaphragm creates a barrier between the wetted parts and the air cylinder. Valve comes standard with a mounting bracket kit, valve air hose, luer lock fluid line, sample packet of DMP inserts and a dispensing tip selection pack.

Techcon Systems, www.techconsystems.com

StratoSphere Series plasma treatment equipment for wafer-level packaging and 3D packaging can now be configured in two, four or six chamber configurations for increased throughput and flexibility. Provide surface preparation and elimination of contamination for ashing, descum, bump, organic contamination removal, and wafer destress during semiconductor manufacturing operations, especially for applications such as 2.5D and 3D wafer-level fan-out. Handles semiconductor wafers up to 300mm (12") in diameter and supports automated handling and processing of round or square wafers. Processes thin wafers with or without a carrier, depending upon wafer thickness.

Nordson March, nordson.com

Vault Tooling Part Holder is available in a variety of standard sizes, pin lengths and densities; also can be configured for most applications and machines. Can be used in applications where the reduction of custom tooling, fixtures, molds or jigs is desired. Technology uses a high-density array of pins that automatically conform to the shape of any part. Once locked, it creates a “nest” to hold the part during the desired process. After completion, the tool is reset. Can be used on bench-tops, robots or integrated into machines or work cells.

Production Solutions, www.production-solutions.com

Martin MiniOven 05 BGA/CSP reballing and QFN prebumping system provides enhanced process capability with updated firmware and increased control and temperature stability. Hybrid heating technology heats electronic components similar to a standard reflow oven. A 4-button front display enables fast setup and management of multiple user-defined reballing and prebumping profiles. Profiles are generated using auto profile software and external thermocouple for real-time product temperature feedback. Easybeam Windows-based software enables profile management and backup. Supports inert atmospheres such as nitrogen and uses a gas distribution system.

Finetech, www.finetechusa.com