NPM-W2 placement machine reportedly has a 10% throughput boost and 25% more accuracy, plus a multi-recognition camera. Component range is 03015mm to 120x90mm and 150mm connectors. Features quick-change feeder carts, auto board support setup, and expanded nozzle capacity, along with an intelligent feeder.
Panasonic Factory Solutions Company of America, www.panasonicfa.com
Ionograph SMD V contamination tester has been redesigned and features optional heating capabilities and is controlled by PowerView software. Ionograph BT series comes in small, medium or large versions. Has been modified to enhance safety and ease of maintenance. Both determine cleanliness of electronic components, assemblies with SMT devices, and bare and assembled printed circuit boards.
Specialty Coating Systems, www.scsequip.com
Replacement nozzles for Panasonic NPM placement machine heads come in high-speed (8-, 12- and 16-nozzle) and multifunctional (2- and 3-nozzle) versions. Come in plastic, tool steel, and ceramic. Feature laser-marked factory barcodes. Have hard coating to provide waterproofing, prevent scratches, and increase tool life.
Count On Tools, www.cotinc.com
Stannostar HMM-1000 MSA-based, pure tin plating process is for deposition of reflowable, pure tin in medium- and high-speed equipment. Non-fluoborate process is formulated to produce matte to semi-bright pure tin deposits without oiling out of the organic compounds. Deposits are said to have consistent, stable surface morphology and are suitable as a “low whisker,” lead-free alternative finish. Pure tin deposits contain minimum organic inclusions that exhibit excellent covering power and a high degree of ductility. The deposits exhibit superb solderability and low carbon content over wide temperature and current density ranges, as well as high efficiency, low foam and uniform dissolution of anodes. For plating parts with complex geometries, including electronic housing and connectors.
Enthone, an Alent Co., www.enthone.com
RW1200 SMT/BGA rework system includes high-def vision, IR underheating, and component alignment. Handles boards up to 16.1" x 14.6." Comes standard with a 1.3Mp split-vision CCD camera and 15" 1080p HD display. Joystick-controlled zoom with 230X magnification and high-brightness LED lighting provide superimposed views of component leads and printed circuit board solder pads for alignment using X, Y, and Θ axis µm. In conjunction with its Z-axis drive mechanism and automatic height sensing, it provides ±0.01mm placement accuracy for 0.3mm lead pitch µBGAs and QFPs. Heater nozzles for components from 2 x 2mm to 55 x 55mm direct up to 1200W of hot air from the upper heater to component. Adjustable hot air flow control. 1200W bottom heater is surrounded by a 2700W, rapid IR underheater.
Manncorp, www.manncorp.com
Loftware Spectrum 2.5.2 enterprise labeling solution has unlimited label design capability. Features new cab and PCL 5c drivers for color printing; enhanced live data in design; new label image output options; added language support for global deployments, and Linux printer support. Cab driver enables support for the cab XC series two-color thermal printers and the A+ series, the EOS series, and Mach4 thermal printers. Can position fields and judge spatial relationships between objects on a label. New image device driver outputs label formats and saves image for validation or to email label images.
Loftware, www.loftware.com