AeroJet noncontact jet dispenser offers a fast tact time (height adjustment not required) and a maximum speed of up to 333 shots per sec. Precise jetting mechanism is capable of super micro shot dispensing. Dispenses from side angles as well as uneven surfaces.
Musashi Engineering, www.musashi-engineering.co.jp
Seika Machinery, www.seikausa.com
NEO View visual inspection support system provides secondary, reliable inspection for AOI systems. Automatically tracks and captures defects as transferred by receiving data from AOI. Displays high-resolution, enlarged images with top view and angled view CCD cameras. Captures defects missed by AOI as each inspection site programmed is always confirmed.
Hitachi Giken, www.hgiken.co.jp
Seika Machinery, www.seikausa.com
SuperΣ dispensing system features a digital controller for automatic/manual dispensing. Provides continuous, precise and repeatable dispensing with no dripping. Automatically calculates correct dispensing volume and pressure and detects usage level of remaining dispensing liquid.
Musashi Engineering, www.musashi-engineering.co.jp
Seika Machinery, www.seikausa.com
DXU-580YF is designed for Yamaha feeder models YS and ZITA storage. Holds up to 21 feeders with tape and reel. Dehumidifies and stores MSDs in reels at a humidity level of 1%RH. Conforms to IPC-J-STD 033C.
McDry, www.mcdry.us
Seika Machinery, www.seikausa.com
M8 no-clean solder paste, developed in combination with T4 and finer lead-free alloy powders, provides stable transfer efficiencies. Novel activator system provides durable wetting action, accommodating a range of profiling processes and techniques. Is said to eliminate HiP defects on BGAs and reduce voiding on QFN/BTC components while producing bright shiny solder joints, leaving minimal, high purity residue engineered to be left in place. Based onl NC258 platform.
AIM Solder, www.aimsolder.com
Integra V1 boundary scan demo module detects integration specific faults. Demonstrates integration solutions with test methods such as functional test, in-circuit test, manufacturing defects analyzer and flying probe test. Contains various boundary scan structures, as well as non-boundary scan components. Production faults can be simulated by switch; signal states can be monitored. Additional test points allow testing of non-scannable partitions. Includes production-capable contacting options, such as test points, ribbon cable, GTAP, etc.
Goepel electronic, www.goepel.com
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