ERO-500 reflow oven has five top and five bottom vertical heating zones, and one cooling zone. Uses plenum convection heating for uniform temperature profiling across the entire printed circuit board. Maximum temperature of 320°C. Compatible with most lead and lead-free solder paste profiles. For low- to medium-volume production runs. Status light tower included. Mesh belt or edge rail conveyor units available. Real-time graphic temperature profiler.
DDM Novastar, ddmnovastar.com
Model 8000x SMT screen printers have an advanced-design printing table, high-precision servo motors, adjustable stencil rails and one-touch conveyor-width adjustment to ease changeovers. Come with 2-D vision system.
ESE Co. Ltd.
CN-1751-4 underfill encapsulant is reportedly crack resistant; withstands flexing experienced by flexible printed circuitry or drops and shocks of thin printed circuit assemblies. Reportedly can withstand deformation without cracking; has a modulus higher than traditional reworkable underfills. Has a CTE of 48 ppm/°C. Viscosity is 900 cps. Can be reworked at 170° to 180°C to remove underfill fillet. Underfill residue is scraped off at 170° to 180°C.
Zymet, www.zymet.com
Sigma Link software centralizes all data needed for programming or generated by inspection machines in the line. Can create new programs, reviews and analyze inspection data of multiple machines from the same station. Is Web-based; can access data from anywhere. Is designed to manage several user profiles.
Vi Technology, www.vitechnology.com
MC-LEDV3 pick-and-place machine features three pick-and-place heads mounted on a high-precision, ball-screw-driven gantry. Simultaneous pickup, on-the-fly (vision based) component alignment, and feeder placement optimization combine to achieve placement rates of up to 10,000 LEDs per hour per IPC-9850. Accommodates flexible strips, circular boards for LED bulbs, and long LED tube boards up to 70" (1800mm) long. Places standard and domed LEDs from 1 x 0.5mm to 8 x 8mm, with positive air pressure and Teflon-coated nozzles to aid release of "sticky" components. Feeders specially designed for LED assembly.
Manncorp, www.manncorp.com
Elite performs part library teaching and various recognition tests offline under the recognition environment identical to that of a chip mounter. Is said to improve parts placement quality and increase productivity of the machine by minimizing machine operation loss caused by the part registration and the possibility of defective recognition.
Samsung Techwin, www.samsung-smt.com
Press Releases
- OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
- Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
- ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland.