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AsahiKlin AE-3000 fluorinated solvents have no flash point, no ozone depletion potential and low global warming potential. For use as precision cleaning solvents, moisture displacement fluids, defluxing agents for electronics, and carrier solvents for lubricants. Series includes four products that are nonflammable and noncorrosive. Have low surface tensions, low viscosities and high liquid densities; are chemically and thermally stable.

AGC Chemicals Americas, www.agcchem.com

M10 Multi Level Tester is for automated printed circuit board-level functional testing, flashing and RF tuning of smart devices like mobile phones, smartphones, tablet computers, PCs, motherboards, automotive electronics. Is scalable and modular, and for high volume production.

JOT Automation, www.jotautomation.com

Sigma F8 component mounter has a Quatro (Four-Head Structure) direct drive head. Places passive components as small as 0402s at a placement accuracy of 3 Sigma ± 36 microns. Closed-loop rotary inspection and on-the-fly component recognition. Self-loading feeder. On- and offline programming. Footprint of 1,280 × 2,240 × 1,450 mm. Stores all process and component placement data for PCB and component traceability.


Hitachi High Technologies America, www.hitachi-hta.com



Silicone macromers include monofunctional and heterobifunctional monodisperse reactive fluids. Reactive silicone fluids and materials are for adhesives, binders, ceramic coatings, dielectric coatings, encapsulants, gels, membranes, optical coatings, photolithography, polymer synthesis, and sealants.

Gelest Inc., www.gelest.com

TS9200D Series Jet Tech valve has a replaceable diaphragm. Small mass of diaphragm reportedly permits faster cycle rates. Adjustable.

Techcon Systems, www.techconsystems.com

Sherlock-300F benchtop automated optical inspection system handles components as small as 01005s. PCB assemblies are fed into the machine on a built-in conveyor, eliminating the drawer design typical of benchtop AOI. All program setup and operation is done directly on a touchscreen display using multi-touch gestures.
Generates inspection programs from pick-and-place files or CAD data import. Can be used after stencil printing for 2D solder paste inspection, after placement for component presence, placement and value verification, and after reflow or wave soldering for solder joint and final assembly inspection. Automatically adjusts for board warp and flexible substrates.

Manncorp, www.manncorp.com/aoi/sherlock-300f/



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