HFFR hexane-free flux remover is a fast-drying cleaning solvent. Eliminates low levels of n-Hexane. Is available in 400ml aerosol form with a brush or in 5L bulk containers.

Electrolube, www.electrolube.com

DB-1568-1 low-temperature cure die attach adhesive is for attaching semiconductor die in temperature-sensitive devices. Applications include smart cards, camera modules, and flex circuits. Is more than 90% cured after 30 min. at 80°C; has a dispensing work life greater than 48 hrs (measured as a 25% increase in viscosity. Is reportedly ideal for flexible applications with high peel strength. Can be cured in 1 min. at 180°C.

Engineered Material Systems, www.conductives.com

SensorWATCH is designed to reduce the risk of MSD- and ESD-related defects. Is a humidity and temperature monitoring system that provides customer audit protection, delivers 24/7/365 access to factory conditions worldwide and eliminates manual record keeping. Provides traceability; task-specific instruments, and plug and play install.

ECD, www.sensorwatch.com

AM100 modular placement machine features a single head (single beam) capable of placing components ranging from 0402mm to 120 x 90 x 28mm, large connectors, odd-shaped parts, and advanced packaging types such as PoP. Non-stop changeover allows the next product to be prepped while production is running. Processes large boards. Includes component thickness camera, auto-support pin exchange, PCB warpage detection, and tray verification. Feeders, multifunctional nozzles, and chucks are interchangeable with NPM series.
 
Panasonic Factory Solutions, www.panasonicfa.com