ABI BoardMaster 8000 Plus is for testing and fault-finding on almost any kind of PCB.
Includes:
Comes in a rugged transportable case that also contains a Windows PC.
Saelig, www.saelig.com
TestWay software assesses defect opportunities and identifies possible consequences of inadequate testability and test coverage on a new design. Analyzes each stage of the design-to-delivery workflow. Checks ROHS, reliability, DPMO, BSDL file validation to guide component selection. Verifies electrical DfT guidelines. Includes standard checks and customer’s specific checks. Optimizes test probe placement according to test strategy definitions, estimates test coverage, models the cost, and calculates production yield and TL9000 initial return rates. Estimates test coverage using theoretical models for a range of test and inspection strategies. Exports CAD data into native format usable by assembly machines, AOI, automated x-ray, in-circuit testers, flying probe testers and boundary scan testers. Can read completed test program or test report and compare the coverage between the estimated and measured analysis.
Aster Technologies, www.aster-technologies.com
VS Series vacuum soldering systems feature fast heating and cooling rates, easy profile setup and editing, and data logging. Support use of different gases, formic acid and microwave plasma. All offer a small footprint, and said to reduce solder joints voids. Supports processes such as plasma cleaning and gas exchange for advanced packaging through controlled use of gases during the soft-soldering process at temperatures up to 450C, for oxide-free and void-free connection of chip and substrate. Permit flux-free soldering and use of solder preforms. Degassing and drying can be integrated into a single process. Models include VS320, VS160UG, and VS160S.
Rehm, rehm-group.com
Data Capture Pod is for generating functional test programs. Converts signals from an individual IC or at the edge connector of a PCB into functional test programs for use with PinPoint test and fault finding systems. Provides programmable threshold voltages, sampling rates and trigger conditions, and dedicated analog channels. Includes USB 3.0 and 100BASE-T interfaces. Starts with 96 single-ended digital channels with up to 480 channels by adding expansion modules. Input rates from -2.0v to +4.5v with a sample rate of 200MHz and a pattern depth of 1Mb are standard.
Diagnosys, www.diagnosys.com
NXTP M35 printer supports panel sizes of 350 x 300mm. Is based on NXTP M25, but has a wider body for handling medium sized panels. Available in both single and double conveyor specifications; is for production of automotive and tablet panels. Features include vacuum for holding down the stencil during printing and snap-off, an adjustable squeegee angle, a low-impact clamping mechanism, and solder roll control to prevent air bubbles. Alignment accuracy is ±10µm, suitable for production of parts as small as 0402mm. Features touch-screen operation panel.
Fuji, http://smt.fuji.co.jp/e/
561-50 die attach adhesive attaches semiconductor die in temperature-sensitive devices. Is electrically conductive, and cures more than 90% cured after 30 min. at 80°C. Dispensing work life said to be greater than 48 hr. (measured as a 25% increase in viscosity). Exhibits damp heat resistance and conductivity stability. Fast cures at elevated temperatures (1 min.@180°C). For applications with high peel strength, smart cards, camera modules, flex circuits and other temperature-sensitive applications.
Engineered Materials Systems, www.conductives.com