SM481 chipshooter has a speed of 39,000 cph. Incorporates placement head with one gantry and 10 spindles with "flying" vision. Places 0402 chips through 42mm ICs. Electrically driven feeders, and compatible with SM series pneumatic feeders. Handles PCBs sized 460mm x 400mm through max. 740mm x 460mm max. Auto splicing and auto-loading.
Samsung, www.samsung-smt.com
InstaTrak is an add-on monitoring system that captures process data of an inline aqueous cleaning system. Provides process traceability of printed circuit board assemblies from beginning to end. Has ability to barcode scan a PCB assembly and associate all of the inline process parameters to that board. Process parameters include conveyor speeds, tank temperatures and spray bar pressures. When used in conjunction with PCS, it provides data for chemical concentration and wash pump run hours (bath life). Provides traceability to comply with ISO and FDA standards. Tracks and stores data using a Microsoft SQL database.
Kyzen, www.kyzen.com
Dynamo convection reflow oven is designed for portable electronics. Is for high-volume and high-thermal performance. Eight, 10, and 12 zone air or nitrogen models are available.
BTU International, www.btu.com
Ultima TR2 benchtop selective soldering machine is for low- to medium-volume assembly. A 35-lb-capacity solder pot handles Pb-free or Sn/Pb solders; has a nitrogen hood with micro pre-heater. Point-to-point and drag soldering functions, along with solder pump speed, wave height control, dip height and dwell parameter settings, are fully programmable. Includes a three-axis drive mechanism; moves the PCB rather than the solder pot, providing positional accuracy of ±0.01mm. Has a bottom-side camera to monitor live video from a laptop or PC. Works in conjunction with Ultima SP benchtop fluxing system. A single SP fluxer can support up to three TR2 machines.
Manncorp, www.manncorp.com/selective-soldering/
NanoClear stencil treatment is now reportedly 50% stronger. Reduces frequency of underside cleaning as a result of a reduction in bridging. Treats apertures walls; allows better performance from stencils with low aperture area ratios. Uses self-assembled Monolayers with Phosphonates (SAMPs) that are compatible with common stencil alloys, including stainless steel, electroform, nickel, and e-polished stencils. Monolayers are fewer than 5nm thick and covalently bound to the surface.
Aculon, www.aculon.com
EKRA XACT 4 SI screen and stencil printer now comes with Simplex intuitive user interface. Is said to increase speed and ease of setup.
Asys Group, www.asys-group.com