Selective Stamp Soldering involves fitting a selective soldering machine with a custom stamp soldering nozzle with several aperture indexes around from board to board. Stamp solders small patterns on each printed circuit board. Is reportedly faster than a single nozzle selective soldering routine. Reportedly requires no modifications to selective soldering machine. Nozzle can be removed and exchanged with a standard nozzle. Processes every board in the panel in the same fashion. Has a small multi-port nozzle. A small pattern involving a connector and three other devices takes about 6 to 7 sec.

ACE Production Technologies, www.ace-protech.com

PVA710 dispenses optical bonding adhesives and assembles optical devices in atmosphere without bubbles. For use with optically clear acrylics or silicones. Provides dam and seal dispensing and curing, fill dispensing and cover placement. Applications include bonding touchscreen to LCD, cover glass to LCD, etc. Employs a gantry system featuring precision ball screw slides driven by brushless DC servo motors. Every axis of motion features optical encoder feedback. The cover glass trunnion provides an assembly means where the bonded surface is not contacted by the system. Accommodates panels up to 17" at 16:9.

PVA, www.pva.net

PVA710 dispenses optical bonding adhesives and assembles optical devices in atmosphere without bubbles. For use with optically clear acrylics or silicones. Provides dam and seal dispensing and curing, fill dispensing and cover placement. Applications include bonding touchscreen to LCD, cover glass to LCD, etc. Employs a gantry system featuring precision ball screw slides driven by brushless DC servo motors. Every axis of motion features optical encoder feedback. The cover glass trunnion provides an assembly means where the bonded surface is not contacted by the system. Accommodates panels up to 17" at 16:9.

PVA, www.pva.net

EVS 8K LFHS lead-free solder recovery system features improved thermal efficiency, ease of operation, maintenance and environmental management. New software is said to increase solder recovery rates 15 to 20%. "No hinges" door provides greater, easier access when performing cleaning. Loading tray improved. High solids filtration system increases air flow and dust/smoke capture. Comes with LED monitor to indicate filter changes.

EVS International, www.solderrecovery.com