MaxiReflow HP void-free soldering combines convection heat and a hyper-pneumatic module. Is equipped with an excess pressure chamber. Each heating zone – as well as zones integrated in the hyper-pneumatic chamber – has a tangential fan. Can also be operated without activating hyper-pneumatic chamber.
SEHO Systems, www.seho.de
MaxiReflow HP void-free soldering combines convection heat and a hyper-pneumatic module. Is equipped with an excess pressure chamber. Each heating zone – as well as zones integrated in the hyper-pneumatic chamber – has a tangential fan. Can also be operated without activating hyper-pneumatic chamber.
SEHO Systems, www.seho.de
Flip-Top tubs for Isopropyl Alcohol (IPA) wipes have lids that spring closed automatically. Are eco-friendly; reportedly reduce waste and emissions. Refill packs fit into Flip-Top tubs and disposable tubs. IPA wipes are available in two different grades: 99.8% pure IPA is for tape head cleaning, defluxing, fiber optics maintenance, and other light cleaning; 70% pure IPA has a slower evaporation rate; is for stencil cleaning to remove pastes and adhesives, oven cleaning, and general maintenance cleaning. Are both made of non-woven polyester material, which is low linting and tear and snag resistant.
Techspray, http://www.techspray.com
Flip-Top tubs for Isopropyl Alcohol (IPA) wipes have lids that spring closed automatically. Are eco-friendly; reportedly reduce waste and emissions. Refill packs fit into Flip-Top tubs and disposable tubs. IPA wipes are available in two different grades: 99.8% pure IPA is for tape head cleaning, defluxing, fiber optics maintenance, and other light cleaning; 70% pure IPA has a slower evaporation rate; is for stencil cleaning to remove pastes and adhesives, oven cleaning, and general maintenance cleaning. Are both made of non-woven polyester material, which is low linting and tear and snag resistant.
Techspray, http://www.techspray.com
iico SMT placement machine places a variety of components, including chips, MELFs, electrolytic capacitors, SO, PLCC, QFP, QFN, TSOP, QFP, BGA, µBGA, LGA, CSP, connectors and odd-form SMDs, and can place from a minimum of 0.5 x 0.25 mm (0201) to 50 x 50 mm as standard. Built on the the EP600 and Progress6 platform. Features new encoders on the X and Y axis to improve accuracy, "smart" nozzles with a new magazine; new head fitted with an 8-position turret with optical sensors and high-resolution digital cameras. Includes flat screen monitor and control panel with latest software. Compatible with all Europlacer feeders (including ii-Feed) and equipment. For small volumes and prototypes.
Europlacer, www.europlacer.com
iico SMT placement machine places a variety of components, including chips, MELFs, electrolytic capacitors, SO, PLCC, QFP, QFN, TSOP, QFP, BGA, µBGA, LGA, CSP, connectors and odd-form SMDs, and can place from a minimum of 0.5 x 0.25 mm (0201) to 50 x 50 mm as standard. Built on the the EP600 and Progress6 platform. Features new encoders on the X and Y axis to improve accuracy, "smart" nozzles with a new magazine; new head fitted with an 8-position turret with optical sensors and high-resolution digital cameras. Includes flat screen monitor and control panel with latest software. Compatible with all Europlacer feeders (including ii-Feed) and equipment. For small volumes and prototypes.
Europlacer, www.europlacer.com
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