Pressure Decay Leak Test Calculator is automated and generates nearly instantaneous answers to “what if” modeling of pressure decay leak testing variables from 8-sensor concurrent leak testing technology. Variables that can be manipulated include pressure ranges; leak rate target; number of concurrent pressure decay sensors in use (up to 8 with Optima vT leak and flow tester); customization of test cycle times, including all stages of fill, stabilization, test time, and total, and part/test volume.

USON, Calculators@uson.com

535-10M UV cured epoxy is formulated for disk drive, camera module, optoelectronics and circuit assembly applications. Non-conductive adhesive cures rapidly when exposed to high-intensity UV light. Is low outgassing, flexible, high-strength; does not contain antimony. 

Engineered Material Systems, www.conductives.com

Shrouded male pin connectors are for frequently mated interconnects and blind mate conditions. Double row connectors come in 4- to 64-pin configurations, in through-hole and surface mount termination styles. Shroud extends above pins to limit misalignment between connectors during mating and de-mating. PTH and SMT versions are dual-row with 0.100" spacing pin-to-pin and row-to-row. Connector body is molded from high-temperature thermoplastic with thermal stability, chemical resistance and flammability rating of UL94 V-0. Pins are made from precision-machined brass. Engaging leads are 0.030" in diameter, 0.142" long and gold-plated. Are RoHS compliant and suitable for Pb-free reflow. 

Mill-Max, www.mill-max.com

357-348 wire bond encapsulant and flexible circuit bonding adhesive is for circuit assembly applications. Protects wire bonds and reduces stresses associated with thermal cycling. Reportedly is chemically resistant to inks. Has high fracture toughness and adheres to flexible circuits, FR-4 and metal substrates. Meets ionic cleanliness standards.

Engineered Material Systems, www.conductives.com