iHawk Xpress has an improved transport to handle lead frames up to 100mm wide. Bonding accuracy improved to 3µm, and novel GoCU technology enables faster operation with copper wire. Ensures bonding wire is clamped in place and automatically rethreaded after a break, minimizing downtime and improving productivity.
ASMPT, www.asmpacific.com
OptiCon XI-Pilot 3.0 x-ray inspection system software enables higher image recording speed at increased sensibility. Compensates for PCB warpage or automatic stability control of image sequence. Detects and compensates PCB slag during inspection, for true to height solder layer reconstruction. Determines whether entire assembly or each partial circuit of a value should be compensated. Uses laser triangulation sensor determine PCB warpage. Compensates for PCB slag directly in the recorded images using software algorithm. Automatically detects changes in x-ray image chain and recalibrates images chain at lower deviations of acceptable tolerances. Reportedly ensures image geometry characteristics as well as intensity (grey values) are situated in an adjustable tolerance range.
Goepel Electronic, www.goepel.com
OptiCon SPI-Line 3D solder paste inspection system is offered in three different configurations determined by pixel resolutions of 10µm, 15µm and 20µm. Has inspection speed up to 90cm². Is fully compliant to all OptiCon AOI systems. Has a 3D camera head functionally based on fringe projection principle, operating without moving parts. Includes newly developed user interface SPI-Pilot. Offline programming station and module for statistic process control evaluation are offered as add-on options.
Goepel electronic, www.goepel.com
C-Class Cleaner Series PS300 includes -VL, -VS, -HD, and -CA, featuring PowerSpray technology. Is automatic and 90 x 120 x 160cm (without status light bar). Is for small to medium cleaning quantities. Operates in a closed loop system without water or water disposal connection with a two tank system using TernarySequence, a water-based detergent and an integrated cascade sediment filtration. Features include a combination tank system with one communicating detergent; product handling capability of 780 x 950mm; PLC controlled process time and filter saturation, and stainless steel construction with all process sections made of electrolysis-resistant materials.
Kolb Cleaning Technology, www.kolb-ct.com/en/
YSI-X 3D x-ray is for 100% inspection of onboard automotive products and other items. Standard features include x-ray, optical, infrared and laser height measurement. Comes in three types, with minimum resolutions of 3, 7 and 18 microns. Automatically generates inspection unit data using Yamaha placement equipment data. Auto-corrects for PCB warpage using x-y-z fiducial data. Digital laminography (planar CT) makes composite of multiple x-ray images and captures a horizontal cross-sectional slice at optional height.
Yamaha Motor IM, www.yamaha-motor-im.com
ChipVORX FPGA-based I/O modules are controlled via a standard TAP enabling access to the entire ecosystem of test and programming IPs for external instrumentation. FXT-X90 module is based on a Xilinx FPGA, providing 90 I/O channels, whereby 72 are voltage programmable. Is equipped with a transparent TAP; enables daisy-chained cascading of several boards of the same or different types. Various functions for universal frequency measurement, RAM test, fast Flash programming or control of instruments are provided as IP. Provides a separate clock generator. Can be applied as a boundary scan I/O module with dynamic mode switching capability. Is supported by Scanflex boundary scan controllers System Cascon software.
Goepel electronic, www.goepel.com