Premium Hot Bar Monitoring system is for Hot Bar reflow soldering, heat-seal bonding, ACF-bonding, and heat staking. Measures force, temperature, time and displacement; features Hot Bar connections and high throughput. Is equipped with MG3 Premium Hot Bar Monitor. Dual channel capability offers simultaneous monitoring. Has configurable graphic user interface with four display quadrants, graphic and numeric indicators, and online help. MG3 features on-screen SPC capability that generates real-time monitoring. Includes up to 99 available schedules and password protection. Offers interface infrastructure with RS232 or Ethernet TCP/IP. Process interrupt functions enable steering of the bonding process. USB port provides data storage and data transfer. Hot Bar Modules are integrated.
Miyachi Europe, http://www.miyachieurope.com/products/system/
U5002 closed loop desiccant dry units are designed to exceed challenges associated with IPC J-STD-033C (components) and 1601 (printed circuit boards) for handling moisture sensitive devices. Incorporate molecular sieve desiccant technology. Zeolite dryers feature dehumidification, enabling a 1400 liter cabinet to move from 50%RH to less than 5% in fewer than 4 min. Humidity levels achieved are below 0.5%RH with vapor content. Have been designed to regenerate only when necessary, based on operating load.
Super Dry, www.superdry.info
Through-hole 1mm pitch 860 series headers and 861 series single-row sockets provide support for applications requiring multiple insertions and extractions. Have solder tail diameters of 0.015"and 0.014" respectively. Tail diameters allow for smaller PCB holes. Insulator bodies have standoffs on the termination side of the connectors to aid in solder flow during the soldering process. Header and socket provide a mated height of 0.200" for board stacking applications. Are available in 2 -50 positions and are RoHS compliant; sockets have gold-plated shells and contacts; headers have gold-plated pins.
Mill-Max, www.mill-max.com/PR629
Alpha Argomax silver sinter pastes and films are for die attach applications. Were manufactured to perform well in fast sintering, high-volume manufacturing processes.
Atrox is a conductive adhesive for die attach applications.
Alpha, www.alphacpmd.com
UV2000 ultraviolet light curing oven encloses Fusion UV lamp system, resulting in an 8% reduction in noise output, less RF interference, and enhanced service access. Has lamp height adjustability of 50mm – 200mm, and includes standard light baffles. Convert from single-sided to double-sided oven with four additional parts. Uses UV lamps to initiate fast UV light polymerization of adhesives and coatings. Various UV beam widths available.
PVA, www.pva.net
Model 2651A High Power System SourceMeter Instrument is for testing high power electronics, semiconductors, and materials. Features broad dynamic range, capable of sourcing or sinking up to 2,000W of pulsed power (±40V, ±50A) or 200W of DC power (±10V@±20A, ±20V@±10A, ±40V@±5A).
Keithley Instruments, www.keithley.com