PotWatch features Web-based ordering and a scheduled method for testing, tracking and validating solder pot alloy purity. Solders within most SnPb and SAC alloy matrixes are tested to J-STD-006B standard. Maintains schedule for solder testing and sends e-mail notifications to advise of next test date; follows up with delivery of PotWatch Solder Collection Kit.
SolderLab, www.SolderLab.com
Siplace Gluefeeder is for dual-sided boards and other applications requiring selective gluing and fastening of SMT components. Is not permanently integrated into the placement machine or screen printer. Head guides components over the dispenser where a precision jet applies glue dots to them before they are affixed to the board. Products requiring glued components can be produced on different lines. Can handle deformed PCBs.
ASM Assembly Systems, www.siplace.com
QuantX is a silicone-free family of integrated dispensing components, manufactured using mold designs. Reportedly results in repeatable dispensing and a reduction in assembly rejects. Syringe barrels are available in 3cc, 5cc, 30cc and 55cc, together with accessories. Syringe barrel provides curved path to the dispense tip aperture.
Fisnar, www.fisnar.com/quantx
ezLOAD XL PCB support system is for larger boards. Can be customized for any length and width combination. Is adjustable for multiple applications. Horizontal posts can be unlocked and replaced with longer or shorter ones. Features an extruded aluminum base and soft, ESD-safe foam fingers. PAD features active grip technology to hold boards during assembly; is ESD-safe.
Count On Tools, www.cotinc.com/ezload
Paraquda SMD placement machine now comes with new dispenser option said to be capable of up to 20,000 glue or paste dots per hr. Is mounted directly on the pick-and-place head and can be equipped with a time-pressure or screw dispensing valve. Valve’s vertical motion is controlled by a motor/encoder system; high-resolution laser sensor regulates the distance between the dispensing needle and PCB. Fast exchange system available.
Essemtec, www.essemtec.com
SN100C P810 D4 lead-free solder paste is said to be lower voiding than conventional lead-free solder. Reportedly minimizes mid-chip solder balling and exhibits good wetting on all common substrates. When used in combination with vacuum reflow, produces solder joints on 19x19 mm pads and joints to power transistors with less than 1% voiding. Is based on SN100C.
Nihon Superior Co., www.nihonsuperior.co.jp/english