Circuits Assembly Online Magazine - Features

DDF Innova Direct Die Feeder converts Assembléon’s pick-and-place machine from a high-speed chipshooter into a high-speed flip-chip bonder, feeding devices directly from up to 300-mm wafers. Conversion permits controlled die bonding speeds up to 15,000 components per hour at maximum accuracy, and passive component placements up to 121,000 cph. Handles system-in-package, multichip module, flip-chips and embedded passive and active components. Supplies bare die directly from up to 300mm (12") wafers in flip chip (bumps down) or direct die (bumps up) mode. Wafer mapping ensures that only known-good-dies with sizes from 0.7mm (any edge), are presented to the machine.

Assembléon, www.assembleon.com

UV15 is used for bonding, coating and sealing. Is a 100% reactive epoxy-based UV curable material. Contains no solvents nor other volatiles. Is free of oxygen inhibition. Cures quickly when exposed to UV light with a wavelength range between 320nm and 365nm. Typically cures in thicknesses of a few microns to 0.015-0.020 in. in 15 to 30 sec. or fewer. Cures by a cationic reaction and produces bonds that reportedly have lower shrinkage (1-2%) and higher temp. resistance than most UV systems. Tg is 90°-95°C with a straight UV cure. When post-cured for 30 min. at 125°C, Tg is 125-130°C. Service temp. range is -80°F to +350°F. Resists chemicals, including water, acids, bases, fuels and many solvents.

Master Bond, www.masterbond.com

Arduino Prototyping Shield for surface mount prototyping use novel "EZ" soldering technology for fast and easy soldering.

ezLOAD PCB support system for MPM SPM screen printers is built for batch printing and prototype work. Features machined base plate and soft, ESD-safe foam fingers. ezLOAD PAD features active grip technology to hold boards during the screen printing process; is ESD-safe. Is compatible with any SMT equipment, from pick-and-place to chip shooters, screen printers, dispensers, and AOI equipment. Is customizable.

Count On Tools, www.cotinc.com/ezload

D9600 C-SAM is a general-purpose system for laboratory/failure analysis work or for low-volume production inspection, including software and hardware upgrades. Has a linear motor x-axis scanner that leverages Gen6-style technology. Can select image resolution based on desired pixel spacing, down to 1µm, for the size scan desired. Includes Sonolytics operator interface. PolyGate technology is designed for optimizing imaging at multiple levels simultaneously. Visual PolyGate permits the operator to see all the gates (slices of time/depth to be investigated) chosen for each level of interest within a sample in a dual A-Scan display format. Each gate yields its own image. Permits the capture of up to 100 gates per channel during a single scan. Results can be turned into a 3D volumetric model. Can diagnose features within typical microelectronic samples, such as plastic-encapsulated ICs.

Sonoscan, www.sonoscan.com

800 large format automatic optical inspection system is for printed circuit board assemblies up to 21.6" x 31.5". Offers full-color inspection. Has short programming time and combined pattern matching and condition-based AOI algorithms; has high throughput with excellent defect capture and low false calls on solder paste, components, and solder fillets. THT inspection algorithms allow for 100% inspection of through-hole component leads. Includes telecentric primary lens with the option of up to eight additional cameras for angled inspection, RGB lighting, and through lens illumination. Bench-top and inline versions are available.

MEK/Marantz, www.escapethegreyworld.com