7KDL AOI offers dual-lane capabilities for high-speed manufacturing of products such as smartphones. Has large-board capabilities (up to 21’’ x 11’’) for each of the two lanes. Has built-in SPC tools, including inspection data traceability for real-time feedback.

VI Technology, www.vitechnology.com

TLA6400 portable logic analyzers are for embedded system debug and validation applications. Available in 34, 68, 102, and 136 channel configurations; come with 25 GS/s high-speed timing resolution, up to 667 MHz state timing, up to 64 Mb record length, and iCapture functionality. Can capture buses with clock rates up to 667 MHz and data rates up to 1333 Mb/s. Include Glitch trigger and storage; iView for integration between TLA6400 and more than 100 oscilloscopes, and Microsoft Windows 7 interface. Suited for debug and analysis applications, including signal integrity analysis, FPGA debug and verification, memory system validation, and embedded software integration and debug.

Tektronix, www.tektronix.com

Smart Tweezers ST5 is for component evaluation, on-board impedance testing, and SMT component sorting. Automatically determines the type of component and selects proper range and signal frequency for highest accuracy measurement. LCR-meter displays component type, measurement results, and test conditions used to determine results. Accuracy level is said to be about 0.2%. Also shows parasitic resistance and measurement. Tests for continuity and diodes. Evaluates all passive types of surface mount components, such as resistors, capacitors and inductors as small as 0201 size (0.3 mm).

Siborg Systems, www.smarttweezers.ca

EPM1-2493 low-viscosity, low modulus silicone elastomer has a nominal thermal conductivity of 1 W/mk. Offers bond lines as thin as 5 microns. Adheres materials with differing coefficients of thermal expansion (CTE) for significant stress reduction during thermal cycling. Reportedly reduces or prevents contamination of electronics components in applications exposed to high heat, such as solder reflow at 260°C. Adheres to aluminum, and with a primer achieves average lap shear values of120 psi (0.8 MPa). Is a pourable, conformal liquid for potting/filling recessed areas. Can be used for adhering integrated circuit substrates, base plates or heat sinks, or where grooves or other configurations require a limited flow material. Comes in a 1:1 mix ratio and can be loaded into syringes and dispensed as a one-part material for automated dispensing. Cures at lower temperature but can be heat-accelerated for faster cure time.

NuSil Technology, www.nusil.com