Circuits Assembly Online Magazine - Features

Three new UV-cure encapsulants for use in Smart Card IC module manufacturing are now available: Hysol 3323, Hysol 3327 and Hysol 3329. Developed using single-component epoxy technology, they reportedly provide faster curing times, improved adhesion, minimized tape warpage and excellent performance during reliability testing, compared to existing UV- or thermal-cure encapsulants.

Designed specifically for the encapsulation of wire-bonded dies used in Smart Card ICs. Hysol 3323 has high viscosity and a thixotropic nature, and is used to form the dam, while Hysol 3327 and 3329 are low viscosity materials used for the fill process. 3329 has a higher T_g of 155°C (compared to 110°C for Hysol 3327) and a higher Shore hardness.

Are easy to dispense, adhere strongly to a range of carrier substrates and possess a low coefficient of thermal expansion (45ppm below T_g and 130ppm above T_g). Typical UV cure times per IC module are 26 to 46 sec., which enables a maximum of 10,000 UPH.

Henkel, henkelelectronics.com

LDS9000 mechanical dispensing system is a fully programmable, electric powered and mechanically operated system that is air-free.

Features an easy-to-program control unit and a hand-held dispensing gun that employs a precise, linear actuator-driven piston to push a fluid or adhesive through a plastic syringe. Permits repeatable shots, runs on 115 VAC and eliminates the problems associated with conventional air dispensers such as variations in pressure, moisture and fluid viscosity.

Suitable for in-plant assembly and field maintenance, has a microprocessor-based portable control unit, a foot or hand operated pedal, and gun stand. The software-driven unit knows the I.D. of the syringe, dispense rate and required volume; calculates the precise distance the piston needs to travel. It also draws back to prevent oozing.

Fishman Corp., fishmancorp.com

Version 5 of the Web-based Flopack software enables the creation of Delphi compact models that predict the performance of electronic components under soon-to-be-published thermal testing standards from JEDEC committee JC-15.1. Produces behavioral compact models that can predict the temperature of component packages at critical points such as the junction, case and board. New features include a faster, more accurate nonlinear optimizer, support for additional nodes, user access to setup parameters and the ability to create compact models from non-Flomerics simulation data.

Consists of a collection of "Smart Part" modules installed on a central web server. Users enter data describing the IC package through simple forms using a standard Web browser.

An advanced nonlinear optimization method reportedly provides more accurate Delphi compact models. The new algorithm automatically optimizes the area assigned to each node, eliminating the need for manual nodal partitioning. Provides a more flexible objective function that combines flux and junction temperature contributions. In addition to the top inner/outer and bottom inner/outer nodes supported in the past, the new version also supports up to two side nodes for all packages and up to four lead nodes for leaded packages.

Flomerics, flomerics.com

FKI Logistex has added new features to its 2100 and 2200 series vertical carousels to cater to the SMT, pharmaceutical and automotive dealership industries.

Designed to promote ergonomics, security and safety, the high-throughput capacities and small footprints of the 2100 and 2200 carousels are ideal for high-density small item storage and retrieval solutions.

For the SMT market, the company has added a 19-in. pitch to the 2200 series. The new pitch allows both 7 and 14 in. standard reels to be stored in the same unit. Also has a removable intermediate shelf to enable customization and offers various ESD totes and storage media to maximize unit capacity.

In the semiconductor industry, FKI Logistex will offer an automated variation of the 2100 series, designed to accommodate clean room standards up to Class 1.

Other new features include an upgraded standard keypad controller that allows the operator to key in the pan number for product retrieval and the ability to upgrade the units for software control.

FKI Logistex North America, fkilogistex.com

Full spectrum lighting (FSL), a critical feature for lead-free assembly and inspection applications, is now supplied free of charge on all illuminated magnifier products. Full spectrum light contains the entire range of visible wavelengths, so that the human eye can see all objects and a range of materials; helps to inspect lead-free solder connections.

According to president Richard May, "Lead-free solder connections are not smooth and shiny like those of lead-bearing solders; they are rough, irregular and frosty-looking. This surface appearance makes it even more difficult to see microscopic cracks, voids and defects in a solder joint, or to judge between an acceptable defect level and an unacceptable one. Full Spectrum Lighting gives the inspector or assembler a critical edge in working with lead-free connections, adding enhanced visibility to duller and rougher lead-free alloys so that effective inspection can be accomplished."

The O.C. White Co., ocwhite.com

WILSONVILLE, OR - Expedition and Board Station RE PCB layout tools now come with advanced design capabilities for flex and rigid-flex boards. The Board Station and Expedition design flows now permit definition and checking of flex circuit design rules, including curved trace settings by area, complex contour following for routes, teardrops at pins, t-junctions and route width changes, cross-hatching of shielding areas and selective pad modifications. The enhancements are available now; pricing starts at $7,500 per year. Mentor Graphics www.mentor.com

O.C. White Offers Full Spectrum Lighting for Pb-Free Assembly, Inspection
12-20-2004

The O.C. White Co., ocwhite.com