Using Laser-Microjet technology, the LS 800F cuts from 1 to 10 holes per second (or 36,000 apertures per hour), reportedly without any heat damage, burrs or oxidation.
Uses a fiber laser source uniquely suited for thin, high precision stencils and masks.
Fiber lasers have high pulse-to-pulse stability, are compact, ensure efficiency, are robust, have low consumption of electrical power and are maintenance-free. They do not necessitate any alignment, cleaning or servicing of optical parts. Does not require any lamp or diode exchanges. Diode lifetime surpasses 100,000 hours.
The fiber lasers emit pulses at a repetition rate between 20 and 50 kHz, with a pulse duration measured in nanoseconds. Said to offer a fine cut, higher cutting speed and a higher accuracy than conventional laser sources. 100um fiber core diameter enables users to apply water jets below 30 um.
Synova S.A. (Ecublens, Switzerland)
RemoteTech remote diagnostics service allows Speedline's support center to remotely diagnose and solve customer equipment and application problems.
Customers can expect improved troubleshooting and problem solving over the Internet and telephone, minimizing field service visits, cutting mean time to repair, lowering maintenance costs and reducing staff technical training.
The secure service allows Speedline to access equipment recipe files and error logs, facilitating software upgrade uploading.
The diagnostic services are available for most of Speedline's products currently in production. The customer's equipment must have an Ethernet card or modem, be connected to the Internet and use Microsoft Windows.
The services will be free of charge during the equipment's warranty period and will be included in the company's Protection Plus service contract. Can be purchased on a per-machine basis.
Indium3.1 water-soluble Pb-free solder paste is formulated for fine-pitch applications. The company claims the long stencil life virtually eliminates solder paste waste.
Said to exhibit excellent wetting under both air and nitrogen reflow atmosphere. Residue is easily cleaned with water.
Features a wide reflow window, slump resistance, low voiding and low foaming.
MX-Series SMT assembly systems are for medium- to high-volume operations. They feature real time vacuum monitoring prompts the operator (without stopping the machine), when a job is loaded and when running. When it detects the vacuum threshold in the heads is low, it also alerts the operator. Each feeder, in addition to storing part number, lot code and feeder pitch, carries its presentation performance forever.
The series consists of two systems, MX-310 and MX-240. Features include:
- Placement accuracy of 33 µm at 4-sigma accuracy for QFPs, BGAs and CSPs.
- A line scan camera inspects large parts and odd-form.
- A coplanarity checker inspects parts for pre-placement lead warpage.
- Improved illumination on all systems allows for more LEDs (both collimated and oblique), resulting in improved recognition of the full component range.
- Light settings invoked for each part, preventing machine stoppages from "false failures" due to non-uniform lighting.
- A flip-chip camera, for processing FC devices.
Also, the MX-310 has a four stage transport system that enables 25% more speed when processing 8" x 12" boards; a head mounted servo driver/motion controller that permits machines to run at higher speeds through faster response times and eliminates 75% of the cabling from the head to the bottom chassis.
The MX-240 has a closed-loop force control head to minimize impact force. These spindle-mounted sensors operate in concert with high-response vacuum control for force control; a high-speed tray presentation, a side-mounted P40TSU (40-tray shuttle unit) that presents tray fed components without limiting feeder space or board size; and can be configured with two units, which allows 170 unique part numbers to be held per machine.
Tyco Electronics will premiere the Mirae MX-Series at Assembly Technology Expo, Sept. 26-30, 2004.
http://automation.tycoelectronics.com
3M Wafer Support System for ultra-thin semiconductor wafer backgrinding is an alternative to conventional tape processes and is capable of producing wafers as thin as 20 microns. Permits manufacturers to use existing grinding equipment to produce thinner wafers, at faster grinding speeds, with increased yields. Includes both equipment and consumables for a comprehensive approach to wafer backgrinding support challenges.
Features include:
- A wafer mounter to attach the wafer to the glass plate with liquid adhesive.
- A wafer demounter to separate the glass and adhesive from the wafer after the backgrinding process.
- A glass cleaner/coater.
Consumable materials include 3M ultra-clean UV curable spin-on adhesive and a light-to-heat conversion coating. The LTHC layer enables separation of the adhesive from the glass after the backgrinding process.
Unlike tapes used in other systems, the liquid adhesive used in the 3M system flows into the topography of the wafer, providing even support over the entire surface and providing a rigid, uniform base. The system minimizes stress put on the wafer, resulting in less cracking and increased yields.
KIC announces new software for its SlimKIC 2000 oven.
Features include:
- Temperature vs. time feature, for profiling a variety of processes. Allows running of profiles and and experiments for practically any thermal process (batch processes for cure, environmental temperature cycling, rework, high-temperature processes and more).
- Measures temperatures from -150º to 1,050ºF.
- Permits use of SlimKIC 2000 over a broader range of applications.
- User-defined process window; software calculates PWI .
The software is free of charge on the machine.
KIC provides thermal process development and control software.
www.kicthermal.com
Press Releases
- ViTrox Americas Doubles Capacity at Demo Center in Hutto, Texas
- Absolute EMS Earns ITAR Registration, Strengthening Manufacturing Capabilities for Military and Defense OEM Customers
- The ICAPE Group Announces the Launch of Its E-Shop at Electronica
- ESCATEC Pushes New Boundaries in Micro-Electronics with UV Enhanced Die Bonder Technology