2200 Series BenchMate vibration-free platforms are said to enhance the performance of atomic force microscopes, microhardness testers, profilometers, balances, audio components and other precision tabletop equipment.  Available in three different models, each providing application-specific vibration control with low natural frequency.

Model 2210 features vertical vibration control and uses a passive-air design that can be operated with an optional hand pump if an air source is not available.

Model 2212 uses a self-leveling, active-air unit and is recommended for more regular use.

Model 2214 offers an enhanced, multistage horizontal isolation feature, recommended for applications where both vertical and horizontal vibrations are a problem. The self-leveling, active-air unit that must be connected to a compressor.

Four table sizes are available up to 24 x 36", with table capacities up to 450 lbs. Class 100 cleanroom compatible, with a Class 10 option.  Come with or without mounting holes, which can be tapped on an English (¼-20 x 1") or metric (M6 x 25mm) grid. 

Kinetic Systems Inc., www.kineticsystems.com

Electronic Device Support Suite (eDSS) is a Web-based software application for remote FlashCORE algorithm development. The development kit includes access to a database of new and existing device algorithms. It is designed for implementing new or derivative electronic devices on FlashCORE-based programming systems.

Enables development engineers to achieve first article build for product testing within minutes rather than weeks. Eliminates complex product verification logistics.

Prepares algorithm executables for debugging and release. Accepts algorithm source code files as an input which produce job card files for testing algorithms.

Backed by online documentation, training materials and videos. User and group administration screens provide developer, quality assurance and administrator process roles.

Dow Corning SE 4451 thermally conductive encapsulant has a pre-qualified, turnkey dispensing process. The combined material-and-process offering is one of the first developments to emerge from the External Equipment Provider Alliance launched by Dow Corning earlier this year.

Designed for the heat-management needs of electronic power devices, the encapsulant offers thermal conductivity of 3W/mK at 25°C and 32,000 cPs viscosity. The material's properties enable fast dispense and cure times.

Dow Corning worked with alliance member and dispensing equipment provider Liquid Control Corp. to develop a turnkey dispensing process for the new encapsulant.

The companies will discuss the product and process during a one-hour online seminar on thermal interface materials on Nov. 11, at 11 a.m. EST. Click for more info. 

Version 7.3 of the Trilogy 5000 solution for PCB process preparation and assembly programming operations and the Enterprise 3000 DFM solution for manufacturability and physical design verification of CAD data is now available.

Enhancements to the assembly engineering platform include various feature extensions to the Line Balancing, Documentation Editor and Machine Shapes Manager modules. Siemens SMT machine models S20, S23, S25, HS50, F4 and F5 are now supported..

The updated design environment offers tighter integration to the Cadence Allegro, Mentor Graphics Boardstation and Zuken Board Designer PCB CAD systems. Other extensions to the input/output interfaces include ICT output format. Features BOM and AVL handling, parts library management and DFM with emphasis on Signal Quality Analysis.

Valor Computerized Systems, valor.com