Circuits Assembly Online Magazine - Features

The latest High-Power Target is a transmission target consisting of an interaction layer made of tungsten and a special backing layer that provides improved heat transfer and lower focal spot temperature.

Its construction allows users to operate the x-ray tube with higher energies at the highest possible resolution, allowing for increased image contrast. Ideal for inspecting objects with low-contrast structures, or with high absorption structures.

As a rule, the thermal stress applied to the target increases with decreasing focal spot size and increasing tube power. Focal spot size, however, is a critical factor in determining geometric magnification and image resolution, while tube power influences the x-ray intensity output.

FEINFOCUS, feinfocus.com

Ultra-efficient, low-cost RF power amplifiers enable the manufacture of high-performance, low-cost RF power amplifiers in common silicon semiconductors. Architecture enables models of power amplifiers that inherently perform the function of traditional RF transmitters and eliminate traditional transmitter hardware.

Are monolithic (single chip) implementations that can be produced in less expensive, high-volume silicon semiconductor processes. Offered in two families- the vector power amplifier (VPA) and digital power amplifier (DPA). Both reduce transmitter power consumption for many battery-powered wireless products by 50 to 80%.

Currently for applications up to 3GHz RF frequencies.

ParkerVision Inc., parkervision.com

The 752 series compact, low-maintenance dispense valve reportedly applies accurate, consistent amounts of cyanoacrylate adhesives and other assembly fluids on automated production lines.

Pneumatically operated valve has no tubing to leak or O-rings to wear out. Precision diaphragm rated for tens of millions of cycles provides long, trouble-free operation. A fast, clean cutoff after each shot eliminates dripping, waste and cosmetic damage to parts.

The amount of cyanoacrylate dispensed is determined by fluid pressure, flow rate and valve open time. Adjustable stroke control allows the flow rate to be fine-tuned, while valve open time is regulated with a microprocessor-based controller. Valve open time can be adjusted in increments as small as 0.001 sec.

Ideal for automated assembly machines, XYZ tables and retrofits on current production lines.

EFD Inc. (a divion of Nordson Corp.), efd-inc.com

The EFD 752 series

MX5 high-throughput printer utilizes parallel vision technology for cycle times of less than 5 sec., including printing. Features reliability, ease of use and maintainability. The company's 2 ½-D post-print inspection and vision technology are standard. Configured with various handling systems to process virtually all substrates, including PCBs, ceramics, flex circuits and solar cells. Can use screens or stencils.

EKRA America, ekra.com

PA0766NLT Power Bead integrated ferrite-bead inductor has two independent inductors integrated into a single core structure and part number with no magnetic coupling between them. Can be used in any multi-phase circuit application, including double data rate (DDR) memory, multi-phase CPU power and other desktop, portable and server computing applications, as well as 2- and 4-phase telecommunications power systems.

Replacing two surface-mount iron inductors with one integrated inductor reportedly results in: 20% savings of board space; 47% lower direct current resistance (DCR); 80% lower core loss; reduced AC proximity loss in the winding; and cost reduction of 25%.

Footprint is 0.55 x 0.53 x 0.28" (14.0 x 13.5 x 7.0 mm).

Available in four different inductance values and current ratings from 296 nH at 38 Amps peak current per phase to 568 nH at 18.5 Amps peak current per phase. Direct current resistance is 0.9 milliohms maximum per phase. Rated for operation up to 130°C; RoHS compliant.

Pulse, a Technitrol Co., pulseeng.com

Multicore LF318 is a halide-free, no-clean, pin-testable, lead-free solder paste that promises broad process windows for printing and reflow. Developed to appeal to multinational manufacturers wishing to qualify a single solder paste with reliable, repeatable performance within the assembly environment.

Reportedly achieves a high degree of coalescence upon reflow even after 72 hours at 27° C and 80% RH, and in testing to IPC ANSI/J-STD-005 and JIS-Z-3284 standards displays excellent resistance to slump. Has low paste wastage - the result of superior tack life and an open time greater than 24 hr. - and resistance to component movement during high-speed placement, through its high initial tack force of 2.0g/mm².Suitable for reflow in air or nitrogen, said to display excellent solderability on a range of surface finishes, including Ni/Au, immersion Sn, immersion Ag and OSP copper. Soft, non-stick, colourless residues remain after reflow, easing visual inspection and permitting reliable in-circuit testing.

Available in lead-free alloys 96SC (SAC387) and 97SC (SAC305, and a tin-lead version.

Henkel, henkel.com