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EVP-750 bare board loading station can be positioned at the front of the line or after a magazine line loader. Designed to load stacks of up to 170 PCBs or pass PCBs through from the line loader.

 

Has a precision extruded aluminum framing with painted vanity panels; standard features include a programmable logic controller, open architecture (front loading), load or pass-through models and left to right travel.

 

Also features:

· Master touch button control panel / Auto and Manual modes

· Reliable AC motor with variable transfer speed

· Hand crank width adjustment

· Operator controls

· Audible alarm and three-color light tower

· ESD grounding receptacle

· SMEMA Spec. 1.2/NFPA79 Compliant

· 14 Pin communication cable

 

Can handle products with a thickness of 0.045" (1 mm) minimum, edge contact of 0.118" (3 mm), above board clearance of 1.1" (30 mm) guard and below board clearance of 1.1" (30 mm).

 

www.pro-mation-inc.com

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Solder Coat Co. Ltd. (Nagoya, Japan) is introducing the GTS series of lead-free solder paste in North America and Europe.

The paste can withstand a preheat temperature of up to 200°C for 2 minutes. Does not require refrigeration for storage and transport, thus reducing handling care and cost.

www.all4-pcb.us/lfreesolder1.htm (North America)

www.soldercoat.co.jp

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Pyramax 98 solder reflow oven is now equipped with an integrated flux coating and wafer handling system for wafer bump reflow. The coating system can handle 200 or 300 mm wafers and is configured with an integrated robotic wafer handler.

 

At the oven's back-end, an automated unloading station completes the integrated wafer handling process.

 

Features forced impingement technology for temperature uniformity and an optional closed-loop convection control for constant heat transfer and cooling rates. Provides atmosphere purity below 5ppm and reportedly has the industry's lowest nitrogen consumption.

 

www.btu.com

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The user-friendly SlimKIC 2000 profiler and process development tool has been upgraded to accommodate new applications including rework, batch ovens, and high- temperature furnaces. The new applications are built directly into the standard software at no additional cost.

With the conversion to lead-free manufacturing and its narrow thermal process window, rework is more critical and requires better profiling tools. The new software, which claims to provide better control and documentation of the rework process, is on display at booth 5015 at the Assembly Technology Expo this week in Rosemont, IL.

www.kicthermal.com

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AuL2220 stand-alone, fully automatic printer with auto unload eliminates substrate handling issues for high-volume, fine pitch production. May also eliminate the need for expensive bare-board and magazine loaders. Allows transport upstream automatically to the pick-and-place station. Can be unloaded manually.

 

Equipped with:

  • auto vision alignment with over 10,000 individual program file storage.
  • adjustable magnetic PCB support.
  • programmable squeegee drive, pressure, stroke and speed.
  • understencil wiper module (with vacuum).
  • motorized or programmable conveyor width adjustment.

 

Has 20 x 23" print area; will accommodate both cast and welded tubular stencils.

 

www.smtprinters.com


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Universal Instruments has expanded and enhanced the services element of its Optima Plus solution model and reduced the price of extended warranty products.

 

The productivity solution combines Optima equipment and software with the Plus services portfolio to minimize cost and maximize throughput, yield and profit.

 

The extended warranties provide parts and labor coverage for individual machines and are being offered at significantly reduced globalized prices.

 

www.uic.com

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