TestWay Express provides an integrated workflow for DfT and test coverage analysis from design through to product delivery. Is said to analyze and verify testability at each stage of the design to delivery workflow within a single tool. Verifies mechanical rules, allocates test probes and estimates test coverage based on actual physical access. Generates test programs, input lists and test models, and test fixture files. Operates directly from native CAD formats. Reads completed test program or test report and compares coverage between estimated and measured analysis. Coverage importers available for a range of common test/inspection machines
Aster Technologies, Aster-Technologies.com
SnapSil TN3085 is a one-component, thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature upon exposure to atmospheric moisture. It cures to form an elastic, flame retardant silicone rubber and exhibits primerless adhesion to many substrates.
Momentive Performance Materials, momentiveperformancematerials.com
A test board for the dummy (mechanical sample) version of Amkor’s 0.3mm pitch CVBGA is available. CVBGA368-8mm Evaluation Board is for testing, evaluating and qualifying fine-pitch technology. Board size is 77 x 132mm, 1mm thick, and features four layers with 15 pads. Is offered with OSP, ImAg, and ENIG finishes. Is 8 x 8mm, 368, 0.30mm solder ball pitch, two-layer thin core substrate with an Ni/Au BGA finish that uses a HL832NX-A (60 µm core) and AUS 410 solder mask. Is identical to live package without IC die inside.
Practical Components, www.practicalcomponents.com
A test board for the dummy (mechanical sample) version of Amkor’s 0.3mm pitch CVBGA is available. CVBGA368-8mm Evaluation Board is for testing, evaluating and qualifying fine-pitch technology. Board size is 77 x 132mm, 1mm thick, and features four layers with 15 pads. Is offered with OSP, ImAg, and ENIG finishes. Is 8 x 8mm, 368, 0.30mm solder ball pitch, two-layer thin core substrate with an Ni/Au BGA finish that uses a HL832NX-A (60 µm core) and AUS 410 solder mask. Is identical to live package without IC die inside.
Practical Components, www.practicalcomponents.com
TT-400 tabletop soldering robot platform features 150W hot iron soldering robots, a 400 mm x 365 mm soldering area, tip cleaning station (sponge and air bow off), and camera. Other features include: USB port for program save or load modes to enable program transfer, simulation mode (for process validation prior to soldering), and 64 bit high speed on-board processor. Stores and recalls up to 100 programs, each having up to 9,999 instruction points.
Promation, www.pro-mation-inc.com
GreenData Manager environmental compliance software now exports IPC-1752A XML files at the component level. Can be used as a data conversion tool, generating product-level IPC-1752A XML reports from individual component data. Determines whether a component, subassembly or complete product is compliant with a wide variety of regulations. Substances list now more than 24,000, and recent changes to the REACH SVHC Candidate list included.
GreenSoft Technology, greensofttech.com
Press Releases
- OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
- Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
- ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland.