ScanINSPECT BGA has an intuitive user interface integrated with a high-res, color, 2-D image processing unit. Permits 100% inspection of ball placement on BGAs, in or out of trays. Is a desktop offline system that can be used for pre- or post-reflow ball inspection. Provides for the following ball inspections: presence/absence; size; position; extra balls, and surface quality. Each device or tray is placed on the table, shuttled in, automatically aligned and inspected with a pass or fail result. For use before or after reflow.

ScanCAD International, www.scancad.com

Sigma G5 is a compact, modular mounter available in high-speed and flexible high-speed configurations. Can accommodate board sizes of 510 x 610mm up to 460 x 820mm. Includes a two-head placement system; two quick-change feeder bases that accommodate tape and stick feeders or quick change tray unit with tape feeders, and an Overdrive Control System whereby both heads can pick from each other’s component supply and place on the same board simultaneously. Has EG-100 offline library creation table-top system, NT-100 offline programming station, LISA traceability station, and offline changeover station.

Hitachi High Technologies America – Production Systems Division, www.hitachi-hta.com

Sigma G5 is a compact, modular mounter available in high-speed and flexible high-speed configurations. Can accommodate board sizes of 510 x 610mm up to 460 x 820mm. Includes a two-head placement system; two quick-change feeder bases that accommodate tape and stick feeders or quick change tray unit with tape feeders, and an Overdrive Control System whereby both heads can pick from each other’s component supply and place on the same board simultaneously. Has EG-100 offline library creation table-top system, NT-100 offline programming station, LISA traceability station, and offline changeover station.

Hitachi High Technologies America – Production Systems Division, www.hitachi-hta.com

AR4HT series CSP sockets accept any area-array device for high-temperature testing up to +200°C. Incorporate a low-profile 0.45mm contact structure (compressed) that is shorter than other low-profile contacts. Provide compliance for reliable ATE testing and burn-in. Accommodate BGA, LGA, QFN, DFN, CSP, MLCC and PoP, as well as bumped die with full and partial arrays. Full socket operating temperature is -55° to +200°C, with a life expectancy of more than 10,000 actuations. Socket can accommodate IC devices with a pitch of 0.4mm or greater, as well as mixed pitch environments. Interposer set is comprised of silver particles within a silicon elastomer with a polyimide core. Initial contact force is 20 to 30gm per lead. Available in custom sizes.

Aries Electronics, www.arieselec.com