Circuits Assembly Online Magazine - Features

NXTP-M25 screen printer has two lanes for increased throughput and changeover. Features one-sided operation and the ability to place machines back-to-back. Mask accuracy reportedly is ±10 um. Features low-impact clamping to reduce warpage when panel is clamped. Optional automatic solder supply method minimizes waste.

Fuji Machine Manufacturing Co., Ltd., fuji.co.jp

DataMan 8000 series wireless handheld industrial ID scanner comes with extended range cord-free code reading applications. Communicates via EtherNet/IP, PROFINET, MC Protocol and others, in addition to traditional support for USB and RS-232. Supports industrial protocols for both corded and cordless models. Provides a working range of up to 100m, with a large memory capacity for reading codes when offline or out-of-range. Read every type of code. Offer liquid lens variable focus technology; can read small 2-D direct part marks and long linear 1-D barcodes. 8100 model has bright field illumination.

Cognex, www.cognex.com

Stingray tabletop x-ray inspection system features a cross laser mark to help position test sample. Digital x-ray film measures 36.5 x 25.8mm and resolution is 1916 x 1358 pixels. Features selective enlargement, contrast optimization or grayscale-to-color conversion. Features onscreen measurement of distances and angles. Measuring chamber is easily accessible from front. Runs on Windows 7. Weighs less than 100 kg. High-voltage peak 60-70 kV, ensuring minimum power consumption and maximum security.

Essemtec, www.essemtec.com

Stellar IP automates FPGA image creation by reusing proven IP cores. Creates new FPGA designs by relying on existing IP; extends domain of influence to entire system. Simplifies the integration of new cores that can be reused across multiple designs. Provides a library of off-the-shelf IP cores and automates the creation and compilation of ISE projects, in addition to simulation scripts. Knowledge of HDL language not required.

4DSP, www.4dsp.com

Ecoselect 1 selective soldering system requires less than 3m² of space. Is semiautomatic; uses same technology as Versaflow system. Can handle printed circuit boards sizes up to 406 x 508mm. Includes spray monitoring and continuous pressure monitoring of the flux storage tank. Is equipped with a full-area preheater. Bottom-side heating consists of eight emitters that can be switched in groups to match their power with the assembly’s heat requirements and size. Has universal pallet conveyor; fluxer module with precision spray fluxer; bottom-side preheating via short-wave, dynamic IR emitters; top-side convection heating; Pb-free single point solder module; second solder pot to process two different solder alloys; second solder pot to process multi-up panels; camera/screen for solder process monitoring; barcode scanner; CAD data download of board layouts; operation via touch panel; traceability according to ZVEI standards, and fiducial recognition standard/option.

Ersa, www.ersa.de