The DT series printed circuit board enclosure and header are designed to maintain the integrity and continuity of data and power signals in harsh environments; withstand dust, dirt, moisture and vibration. Thermoplastic enclosure accommodates a 5" x 6.5" PCB and features through-hole mounting flanges. Environmentally sealed snap in header features 90° molded in pins that mate with standard DT series plugs. Header is available in 12, 24, 36 or 48 cavity arrangements that accept size 16 contacts and 14-20 AWG wire.
LADD Industries, www.laddinc.com
3D inline x-ray system is available in X3 universal standard system and X3+, with triple detector setup. Both are based on the hardware concept of X2.5. 3D-Software uses a dedicated number of angle projections for 3D reconstruction; delivers 3D slice images needed for solder joint analysis. With algebraic reconstruction method, it is possible to generate high-resolution images for a reliable analysis with only a few projections. Analyze double-sided boards with high packing density. Generated slice images allow a separate 3D analysis for both sides of the board. Include inspection of high power components with heat sinks, where single contact layers can be separated for void or solder wetting analysis; a multilayer analysis of a solder joint is possible with digital 3D tomosynthesis. Use MIPS platform with links to all MIPS software modules for programming, classifying and verification.
MatriX Technologies, www.m-xt.com
Custom SMT pick-and-place nozzles for Cree XLamp XP-E high-efficiency white LED components reportedly reduce LED count by 50%. Designed to avoid placing mechanical stress on LED lens by not touching optical surface during component picking or placement processes. Can be applied to any style pick-and-place nozzle.
Count On Tools, www.cotinc.com
DE 440 three-stage reflow oven is equipped with integrated heating and cooling plates that can be individually controlled. Temperature is controlled by a 3.5-digit microprocessed controller with a PID system. Is designed for volume production with various materials; works at up to 500°C. Designed to run flux-less and void-less soldering processes with various gas atmospheres as N2 and N2H2. Plate size is 486mm x 486mm.
ATV Technologie, http://www.atv-tech.de/en/p05-3-stage-vacuum-reflow-oven.html
SI-G200 high-speed mounter has a placement tact time of 0.08 sec. Is a two-head model: high-speed head and multifunction head; uses one head for placement and the other for pickup. High-speed head places up to 45,000 components per hr.; placement precision is 45μm (Cpk 1 or greater); component size ranges from 0402 up to a 12mm2 (movable camera) and 6mm2 to 25mm2 (fixed camera). Multifunction head has a placement tact time of 0.16 sec./2 heads (22,500 CPH); placement precision is 50μm (Cpk 1or greater) (individual recognition) and 60μm (Cpk 1or greater) (collective recognition); component size ranges 01005 to 100mm x 50mm.
Sony, http://www.sonysms.co.jp/language/English/product/SMT/Mounter/SI-G200.html
M40 solder pastes are low silver for reduced cost lead-free soldering. Is said to maintain workability of higher silver pastes and overcome reduction in thermal fatigure resistance. Is said to prevent tombstoning and limit solder surface glare. Solidus temperature is 211C, peak temperature is 222C. Is a SnAg1.0Cu0.7Bi1.6 alloy. Halogen-free version available.
Senju Metal, www.senju-m.co.jp/en/product/ecosolder/halogenfree/index.html
Press Releases
- OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
- Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
- ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland.