Remote Instrumentation Controller 4000 (RIC-4000) for ScanWorks platform for embedded instruments can connect over an Ethernet network and apply boundary scan tests on as many as four circuit boards simultaneously. Units under test and ScanWorks can be on the same local network or connected via Internet. Features four test access ports that connect the UUTs to ScanWorks, which applies test routines without physically probing the boards. Many parameters on the four TAPs can be individually configured; they don’t need to be identical. Test routines can be processed step-by-step in real time to locate faults on device pins or chip interconnects. Can be used to load programs or data into programmable devices like flash memory that have already been soldered to a circuit board.

Asset InterTech, www.asset-intertech.com

TR7550 SII inline AOI offers a dual-lane configuration and has a 64-bit operating environment; permits multi-core processing technology. Has expanded memory capacity. Image FOV has doubled in size, reducing the number of scans required and reportedly cutting inspection times in half. Linear motor and linear scale create a stable X-Y table motion system. Includes digital 3 CCD full-color camera at the top and four angle cameras; RGB 3-color LED color lighting system and multi-angle lighting control system. Inspection is suitable for Pb-free manufacturing and fine-pitch/01005 components. Repair station system has graphical interface. Provides SPC calculations and reports.

TRI, www.tri.com.tw

TR7550 SII inline AOI offers a dual-lane configuration and has a 64-bit operating environment; permits multi-core processing technology. Has expanded memory capacity. Image FOV has doubled in size, reducing the number of scans required and reportedly cutting inspection times in half. Linear motor and linear scale create a stable X-Y table motion system. Includes digital 3 CCD full-color camera at the top and four angle cameras; RGB 3-color LED color lighting system and multi-angle lighting control system. Inspection is suitable for Pb-free manufacturing and fine-pitch/01005 components. Repair station system has graphical interface. Provides SPC calculations and reports.

TRI, www.tri.com.tw

ESLE-10 one-part silver-loaded epoxy resin for conductive bonding offers mechanical bonds and electrical conductivity. Reportedly has excellent adhesion; can be used as a conductive bond between solder-free surface mount connections, solder repairs, static discharge and grounding or general conductive adhesions. Operating temperature is -30 to +130°C. Has an electrical resistivity value of <0.0005 ohm-cm.

ES501 underfill resin is said to improve adhesion strength of devices during mechanical stress. Reportedly does not compromise thermal cycle performance. Can be reworked, and used in high-volume assembly. Provides void-free underfill of area array devices; has snap-curable properties. Typical curing times of 35-40 min. at 90°C or 3 min. at 150°C.

Electrolube, www.electrolube.com