Multitest Plug & Yield is for test of 3D packages. Consists of Multitest InStrip3D, a test interface board and a contacting solution based on vertical spring technology. Is used for electrical test of partial stacks during assembly of a mobile SoC. Meets requirements of partial stack test with respect to sensitive bare dies. Uses load board for fine-pitch, high layer count PCBs to support this 0.4mm pitch array application in a high pin count multisite configuration. Accommodates increased forces from the dense pogo array of approximately 6000 pins.

Multitest, www.multitest.com

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