Zebra 2005 Elastomeric Connector is for smaller consumer electronic products and commercial instrumentation. Can be ordered in application-specific widths ranging from 0.015" to 0.118". The layered carbon-filled and non-conductive silicone construction incorporates 500 conductors per in. to accommodate applications with LCD contact spacing of 0.006". Offers a current carrying capacity of 50 mA per 0.040" x 0.040" pad. Can be ordered with solid or sponge edge supports. Has low compression force material. 

Fujipoly America Corp., www.fujipoly.com

MAX series dispensing systems are configured with PCD volumetric dispense technology and a Micro-Dot pump. Are ideal for silver-filled conductive and nonconductive epoxies, solder pastes, adhesives, encapsulants and other fluids used in electronics assembly. Compatible with all GPD’s dispensing pumps, including the Micro-Dot for dispensing below 0.010". Are designed with a 100% molded, unibody frame. Have Contour Mapping software; provide ±0.001" accuracy over the entire work area. Handle up to two different dispense pumps simultaneously. Can be configured with heat for applications such as underfill, encapsulation, or others that may benefit from a heated product.

GPD Global, www.gpd-global.com

Smart GUI software for Siplace placement machines features a new graphical user interface. Displays essential data about the machine's status, current jobs and their progress. If the software detects problems on the line, it converts instantly into an analysis and instruction tool. Categorizes the malfunction and indicates the exact location (machine and track). Initiates self-healing procedures or starts a video assistant to display the steps needed to fix problems. Graphics provide a troubleshooting process step by step. Line personnel reportedly can fix more than 90% of incidents without a special technician.

ASM Assembly Systems, www.siplace.com

Multicore MF210 no-clean, sustained activity flux is compatible with Pb-free and SnPb processes.  Halide-free, resin-free material is effective with a range of solder resists, as well as rosin and OSPs. Has a wide process window and a preheat temperature range of 80° to 130°C; has a one- to three-sec. contact time on the wave. Can be used in single- and dual-wave processes. Reduces solder microballing.

Henkel Electronic Materials, www.henkel.com/electronics