PTP VP-8 thermal profiling kit is for vapor phase soldering. Uses M.O.L.E. MAP software in combination with PTP vapor phase profiler. Characterizes and verifies key process parameters for complex or high-mass PCB assemblies. Dimensions are 90 x 100 x 50 mm. Includes PTP TX transmitter, PTP RX receiver, 8 Type-K thermocouples with mini connectors, USB cables, and a carrying case.
ECD, www.ecd.com/products/ptpvp8
WBC matrix connector is an interconnect pad for LGAs with 200 or more circuit board I/Os. Reportedly eliminates solder and component rework. Is embedded with 300 to 2,000 curved wires per cm2 and provides a current carrying capacity of 500 mA/mm2. Curved orientation permits repeated compressions; for applications that require multiple inspection processes. Is silicone-based and comes in sizes up to 50 x 50 mm and thicknesses of 0.50 or 1.0 mm.
Fujipoly America Corp. www.fujiploy.com
Potting capabilities are now available on the SCS Precisioncoat spray coating and dispense system. Dispenses silicones, epoxies, urethanes, etc. in a variety of applications to seal, stabilize and/or protect applications throughout the automotive, electronics, energy, lighting, industrial and military/aerospace industries. Automates potting process. Can control volume of material dispensed. Can be configured with one head or multiple heads, and can dispense one- or two-part materials.
Specialty Coating Systems, www.scscoatings.com
SpotCheck Reel Estimator is a handheld digital meter for determining tape and reel part counts. Reportedly determines part counts to within 5% for any surface mount part supplied on tape and reel. Operator enters the OD value, the ID value, the number of holes per part and the thickness of the tape; the part count is displayed on the meter. Works with 7" and 13" reels.
Innoquest Inc., www.SpotCheckTech.com
The 3 megapixel Mini Hawk compact direct part mark imager is designed for reading small 2D direct part marks. Is available in high-speed and high-resolution configurations. Can read damaged or distorted symbols. Includes integrated lighting and autofocus. Uses X-Mode decoding technology; X-Mode decode firmware decodes algorithms for 1D and 2D codes with aggressive DPM reading capabilities.
Microscan, www.microscan.com
NC676 is a no-clean halogen-free leaded solder paste. Is compatible with 63/37, 62/36/2 alloys with Type 3, 4 and 5 solder meshes. Features print volume consistency down to 12 mm circles and IPC 7095 Class III resistance to voiding using straight ramp and soak reflow profiles. Leaves a penetrable, colorless residue. Reportedly offers excellent resistance to hot and cold slump. Offers minimal residue, shiny SnPb solder joints and excellent solder spread on all common pad finishes. Features high-volume repeatability with 16 mm pitch QFP pads and excellent response to one-hour pause after two knead strokes at 35-65% RH.
FCT Assembly, www.fctassembly.com
Press Releases
- OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
- Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
- ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland.