Circuits Assembly Online Magazine - Features

PCB123 v4 advanced software design tool has an intuitive CAD interface for freedom and flexibility in schematic and layout editing. Features 500,000 new parts, improved search functionality with complete access to parts libraries, automated BoM, data importer that imports DXF files from mechanical CAD tools. Integrates DRC/DfM rules into the software. Offers research, availability and pricing for each component registered in the Digi-Key database. Is free and requires no license.

Sunstone Circuits, www.sunstone.com

3800 Die Bonder has 3.5 µm accuracy, 3 sigma and 2600 UPH over a 35.5" x 20" work envelope. Has quiet linear motors and is fully automated. Is suited for HB/HP LED assembly; microwave modules; RF power amps; complex hybrids; MEMS; laser diodes, and LED printhead attachment. Options include pulse heat and steady state stages for eutectic die attach applications. Comes with a process camera for live viewing of pick-and-place processes. Eight-position tool turret enables rapid tool changes. Has removable side panels with a front facing user interface.

Palomar Technologies, www.palomartechnologies.com

Kimtech Pure M3 sterile pouch facemask is for contamination control in sterile environments. Is recommended for use in ISO Class 5 or higher cleanrooms. Pouch design and large breathing chamber reduce the chance for particle buildup. Tight seal reduces goggle fogging and the risk of escaping particles. Two knitted headbands help hold the mask in place. Has fabric inner facing. Is made of apertured, low-lint polyethylene film; contains no natural rubber latex.

Kimberly-Clark, www.kimtech.com

BR 300 soldering robot is based on four numerical axes for the automation of bottom-side selective point-to-point or linear iron soldering operations. Enables soldering tasks of through-hole components without complex handling. Components can be placed automatically. Performs placement and soldering operations rapidly.

MTA Automation Inc., www.mtaautomation.com

RMA250 Solder Paste is a rosin-based chemistry designed to provide a high level of repeatability and consistency. Reportedly offers excellent open time, extended abandon time, and excellent soldering activity with all surface finishes. Is formulated for fast printing and meets requirements for ANSI/J-STD -004, -005, as well as all Bellcore test criteria. The pin probable paste features excellent print volume consistency with surface area ratios as low as 0.55 when used with UltraSlic stencil technology. Has a low voiding/high-reliability composition and a wide reflow window. Post-process residues are clear and can be removed with a saponifier.

FCT Assembly, www.fctassembly.com

High-density, 0.050" pitch through-hole and surface mount spring-loaded connectors come in single and double-row strip packaging. Spring pin components are plated with 20 µm hard gold and assembled in a high-temperature thermoplastic insulator suitable for wave and reflow soldering processes. Are RoHS-compliant.

Series 854-22-0XX-10-001101 and 855-22-0XX-10-001101 through-hole insulators feature molded standoffs. Tail diameters of 0.016" require minimal diameter plated holes for connector mounting. Surface mount spring connectors are low profile, standing less than 0.230" tall when engaged mid-stroke (0.0275"). Each SMT spring pin features a base geometry of 0.030" round by 0.010" tall.

Through-hole (Series 856-10-0XX-10-051000 and 857-10-0XX-10-051000) and surface mount (Series 856-10-0XX-30-051000 and 857-10-0XX-30-051000) 0.050" pitch target connectors provide a gold-plated, flat and conductive mating surface for the 854/855 series. Series 856/857 are precision-machined and assembled into thermoplastic insulators. Suitable for reflow soldering.

Mill-Max, www.mill-max.com