PACTECH PCB310 is for placement and daisy chain continuity testing after assembly. Substrate has 28 mounting sites for 10 x 10 mm flip chips; is companion to PACTECH dummy flip chips. Test die are combined with test boards for testing a variety of specs and processes. There are two rows of seven pads. Depending on die, they have either 184 bumps and a bump pitch of 200 µm or 572 bumps and a pitch of 200 µm/400 µm. Evaluation board is 6.3" x 3.95"; has two layers and is 0.062" thick. Board material is high temp Tg. Standard board finish is OSP Entek CU-A-HT.

Practical Components Inc., www.practicalcomponents.com

The Mixed Technology Training Kit is now available in both Pb-free and SnPb versions. Offers a mixture of through-hole and SMT. Contains common components found in mature technology applications. Parts are packaged in static shield bags.

STI Electronics Inc., www.stielectronicsinc.com

PCB123 v4 advanced software design tool has an intuitive CAD interface for freedom and flexibility in schematic and layout editing. Features 500,000 new parts, improved search functionality with complete access to parts libraries, automated BoM, data importer that imports DXF files from mechanical CAD tools. Integrates DRC/DfM rules into the software. Offers research, availability and pricing for each component registered in the Digi-Key database. Is free and requires no license.

Sunstone Circuits, www.sunstone.com

3800 Die Bonder has 3.5 µm accuracy, 3 sigma and 2600 UPH over a 35.5" x 20" work envelope. Has quiet linear motors and is fully automated. Is suited for HB/HP LED assembly; microwave modules; RF power amps; complex hybrids; MEMS; laser diodes, and LED printhead attachment. Options include pulse heat and steady state stages for eutectic die attach applications. Comes with a process camera for live viewing of pick-and-place processes. Eight-position tool turret enables rapid tool changes. Has removable side panels with a front facing user interface.

Palomar Technologies, www.palomartechnologies.com