Keratherm U 90 silicone-free thermal interface material has a light tack adhesive to provide high thermal conductivity where contamination threats prevent the use of silicone-based thermal pads; permits easy positioning between components and heat sinks. Is a ceramic-filled polyurethane film with a thermal conductivity of 6.0 W/mK and thermal impedance of 0.05 Kin²/W. Is available in thicknesses of 0.125 mm, 0.225 mm and 0.325 mm. Keratherm U 80 provides 1.8 W/mK of thermal conductivity and 0.11 Kin²/W of thermal impedance; is 0.175 mm and 0.325 mm thick. Typical applications include medical devices, laser equipment, LED lighting, solar energy, disk drives and automotive electronics. Both are available on roll stock or custom shaped pads.

MH&W International Corp., www.mhw-thermal.com

No. 931 is an electrically heated, 1250°F high-temperature universal oven used for various heat treatments. Workspace dimensions measure 25" x 36" x 24". 18 kW are installed in Incoloy-sheathed tubular heating elements, while a 1000 CFM, 1-HP recirculating blower provides a universal front-to-rear airflow to the load. Features 10"-thick insulated walls, comprising 2" of 1900°F block and 8" of 10 lb/cf density rockwool insulation. Includes an aluminized steel exterior, Type 304 stainless steel interior, and a motor-operated vertical lift door controlled by a foot pedal. Includes digital indicating temperature controller, manual rest excess temperature controller with separate contactors, recirculating blower airflow safety switch, fused disconnect switch, and a 10' power cord.

The Grieve Corp., www.grievecorp.com

Q-BI58 is Pb-free solid wire for heat-sensitive assemblies. Is composed of 42% tin and 58% bismuth wire solder. Is a soldering alternative for heat-sensitive components that require a low melting point. Meets or exceeds J-STD-006 requirements and all other relevant standards. Sn42/Bi58 is sold per 500 g. box, and is available in a wide variety of diameters.

Qualitek International Inc., www.qualitek.com

Ablestik WBC-8901UV is for stacked die packages for the memory market, including TSOPs, MCPs and FMCs. Reportedly reduces total cost of ownership up to 50% compared to film. Can adjust die attach thickness based on specific manufacturing requirements; can select dicing tape of choice. Is applied via a spray coating method following wafer thinning process. Dicing tape is laminated to the wafer; backgrinding tape is removed, and the wafer is diced in preparation for die pickup and placement. Wafer coating of 10 µm, with a total thickness variation across the wafer of +/-10%, and material waste of less than 20% are possible.

Henkel, www.henkelna.com