UltraSlic FG solder paste stencil has paste release below surface area ratios of 0.5. Uses Datum Alloys’ fine grain stencil material. Is said to provide superior aperture registration, higher performance and lower cost compared to electroform. Step stencils optional.
 
Fine Line Stencil, www.finelinestencil.com
 

VPS Condenso Vacuum condensation reflow system is said to minimize void rates by subjecting the molten solder to a vacuum, removing residues and gas inclusions that would otherwise result in voids in the solidified joint. Reportedly can produce solder joints with surface contact ratios of greater than 99%. Releases even heat during condensation and maintains constant temperature. Limits maximum soldering temperatures so PCBs do not sustain damage from overheat.

Rehm Thermal Systems, www.rehm-group.com

Valve Product Guide is comprehensive and easily navigated. Includes manual valves, pneumatic valves and auger valves, as well as accessories and application examples. Manual valves featured include TS1201 pinch tube pen, which requires no cleaning, and Diaphragm Valves, which feature a new compact design. Featured pneumatic valves include the TS1212 Pinch Tube Valve, which features disposable wetted parts and requires no cleaning, and TS5620 Series Diaphragm Valves, which permit horizontal or vertical mounting. The featured auger valves include the TS5000DMP Series Auger Valve, featuring a disposable material path, and the TS7000 Series Auger Valve, capable of achieving 0.25 mm dot sizes.

Techcon Systems, a product group of OK International, www.techconsystems.com