Mytrace traceability software is fully automatic. Quickly traces mounted components to PCBs. Can archive data with no manual procedures. Is future-proof and modular. Stores data in an application-independent format that does not rely on a particular database technology.
Laser Radar Driver 5.1 software is said to set precision standards for automated, noncontact inspection of holes in large measuring volumes. Reportedly up to 30 times more accurate and repeatable than previous versions. Supports automatic freeform surface measurement and feature detection/inspection without SMR or other targeting tools. Can inspect hole feature position and diameter in large-scale applications. Features manual and automatic modes for inspection of hole features. In automatic mode, automatically moves from one hole to another, taking high speed measurements. Uses a 0 to 45º laser incident angle within an 8 m. perimeter; is said to realize average mean accuracy between 10 µm for holes with a diameter of 3.2 mm. Captures hole position and diameter up to a distance of 24 m.
CAM350 Release 10 and BluePrint-PCB Release 2 are being shipped and offered for download. Are integrated for PCB post-processing. Used together, they create and distribute a complete PCB fabrication and assembly release package in a single electronic file. CAM350-150 is a new configuration featuring design, Gerber, and NC importation viewing and editing; solder and paste mask creation; assembly panel array definition; design rule checking on design and Gerber data; netlist comparison between the design and Gerber data; DXF and ODB++ importation, and cross-probing to Allegro, PADS, and Expedition PCB layout systems; includes release package navigator. Reportedly can add virtually any file format, including PDF, DXF, design and schematic files.
EVS 7000 and EVS 9000 process solder dross in a reduced footprint. Feature advanced electronic controls and integrated diagnostics. EVS 7000 offers a capacity of 10 kg/20 lb.; EVS 9000 provides up to 20 kg/44 lb. EVS 9000 has the ability for single operation de-drossing; is said to speed de-drossing times up to 75%. Uses heat and pressure inside a magnetized cylinder to separate and return pure solder into an ingot tray. The remainder is automatically ejected down a sealed chute into a dross bucket. Both reportedly recover 50-70% pure solder from dross. Use no chemicals, additives or toxic substances.
Ring Dex filling and capping system is said to be ideal for processing small bottles, tubes and vials in a benchtop package. Features a file-based control system requiring no PC for operation. Setup of fill volumes, capping torques and checking weights is done with pre-programmed graphical interface screens. Production data (for each container) are time and date stamped with recorded fill weight. File may be uploaded for documentation and reporting requirements. Includes an on-board calibration routine.
Quad Lane conveyor system handles four PCBs side-by-side on a single machine. Can produce the same or different products on each track or any combination thereof. When larger boards are needed, switching to traditional transport concepts like the single conveyor, synchronous or asynchronous dual conveyor or i-Placement can be accomplished via software. Available as an option for Siplace X4 and Siplace X4i placement machines.