Weller WHP200 under-board heater is designed to speed up repair of small multilayer PCBs. Is said to offer easy temperature adjustment. An infrared plate provides controlled heating. Set temperature and actual temperature are digitally displayed. Includes a PCB board holder.
Sarcon XR-Pe is a putty-like thermal interface material. Is said to help improve semiconductor performance by transferring unwanted heat to a nearby heat sink. Is silicone-based and conforms to most CPU and semiconductor shapes with a low compression force requirement. Is maintained for applications that require up to 90% material compression. Reportedly offers thermal conductivity of 11 watt/m-k with a broad operating temperature from -60°C to +200°C. Is available in 2.0 or 1.5-mm thick sheets up to a maximum dimension of 300 mm x 200 mm. Can be ordered in die-cut form.
Manual Tip-Seal Kiss dispense valve is said to be ideal for dispensing low- to high-viscosity one-component adhesive and sealant materials such as silicone or polyurethane. Is used in repetitive fluid dispensing applications. Pistol grip assembly has an electric trigger with a guard and foam grip. Can be set to close valve for visual dispensing or automatically close the Tip-Seal valve for precision-metered volume of material. Is said to be ideal for dispensing solvent-based, moisture-curing and stringy materials such as silicones or polyurethanes. Has carbide tip, titanium-coated shaft, hardened seat and wear-resistant fluid seals.
AlSiC (Aluminum Silicon Carbide) is a metal matrix composite packaging solution for traditional hermetic packaging applications. Is said to have a lower density value – 1/5 to 1/6 lighter in weight than CuMo and CuW, respectively – yet similar thermal conductivity and expansion coefficient. Designs reportedly are cast to the final shape, requiring no secondary machining. Net-shape casting capability enables direct creation of functional design features, such as pockets for circulators and cavities or pedestals for the die. A hermetic package assembled with an AlSiC base brazed to an alloy 48 frame is hermetic to better than 10-9 atm-cm3/s. Is RoHS compliant.
Electrolock-XP RoHS-compliant solder pallet material is molded under high pressure, reportedly providing a lower profile surface chemically inert and heat-resistant. Is said to meet flatness and thickness requirements without surface grinding; sustains more than 12,000 cycles of operation with virtually no surface degradation. Is compatible with Pb-free solder and halide flux systems. Can be used as carrier in wave solder and SMT processing applications, including Pb-free soldering, conformal coating, composite tooling, and ESD-safe tooling.
GreenData Manager-REACH is a desktop application to manage and analyze green compliance data and documents. Permits tracking and reporting on the presence of substances of very high concern (as identified by REACH). Also helps collect and manage a range of green compliance data: RoHS compliance status and certificates from suppliers, material composition substance data, MSL and peak temperature data for Pb-free manufacturing, Sn-whisker mitigation strategies, MSDS forms and test reports. Is said to analyze any REACH-related substance on individual parts or products/BOMs; roll-up substance weight or ppm on assemblies and products/BOMs; report compliance status on all parts or products for REACH SVHC, EU RoHS, China RoHS, Norway PoHS, and halogen-free; determine status of the collection of required data and documents; create audit trail; generate compliance reports on individual components or products; generate compliance and substance analysis reports on individual components or products; use the built-in substance library and add new substances; receive automated updates of changes to regulations and substance lists.