Cover-Extend Technology is a limited access solution for in-circuit test. Is said to eliminate the need for physical test points. Is part of VTEP v2.0 Powered test suite. Is a hybrid between Boundary Scan and VTEP Vectorless Test. Relies on stimulus provided by Boundary Scan cells. Benefits reportedly include improved test coverage (up to 50% node access); savings on fixturing, and strain relief on solder joints.
 
Agilent Technologies Inc., www.agilent.com 
 

RTV 800 Series UV/Dual (UV/moisture) cure materials, for encapsulating and staking sensitive components, have reported cure speeds of fewer than three seconds. Patented chemistry permits paste-like products to cure up to 5/8" thick with minimal energy requirements. Viscosity of encapsulant ranges from a few hundred centipoises (for spraying and dip coating) to several thousand for thick coating and deeper potting applications up to 3/8" thick. Are self-leveling and flowable, and shadow cure at room temperature. Are based on silicone chemistry, translucent, and do not degrade or yellow on long-term exposure to light. 
 
Novagard Solutions, www.novagardsolutions.com
 
 
 

The large-area Photon Vi print platform is designed for integrated manufacturing and process optimization. Delivers flexible substrate image size range from 1.5" x 2.0" up to 24" x 24", a reported 30% increase over the standard platform. Is able to handle board products up to 16.5 lb. and 0.236" thick. Accommodates Instinctiv productivity tools. Has adjustable transport rails and a two-speed board transport control system with software time lag control. Is preconfigured with an upgraded understencil cleaner deploying a 4-stage head, providing cleaning for a 24"wide image using wet, vacuum and dry strokes.

DEK, www.dek.com
 

Instinctiv V9 machine control software now incorporates enhanced control of HawkEye post-print inspection technology, easing paste-on-pad verification. Reportedly provides post-print verification of every board, and operates at line beat rate, delivering go/no-go indication for each board and isolating faulty boards in real-time. Identifies pad exhibiting the lowest paste volume.

DEK, www.dek.com