The Spectrum S-920 series of scalable dispensing features software and hardware control based on Fluidmove XP software with process control features. Rapid response heater system reportedly minimizes startup time and delivers uniform heat across entire part surface. Controlled process heat software can be added. Includes programmable fluid and valve pressure, mass flow control, calibrated process jetting, and a digital vision system. Can be configured with single or dual lanes, and one to three heat stations. Platform can be upgraded and configured to meet dispensing requirements. Uses noncontact jetting technology for applications such as stacked die underfill, chip scale package underfill, and UV gaskets for LCDs. Reportedly dispenses into 200 µm gaps; offers dispensing with flow rates up to 500 mg/sec. and shot rates up to 200 dots/sec. Footprint is 600 x 1321 mm with a single heat station, 850 mm x 1321 mm for two heat stations, and 1100 x 1321 mm for three.
Hysol PC62 toluene-free conformal coating is based on the Hysol PC52 platform; is a one-component solvent-based acrylic conformal coating. Is reportedly quick drying. Designed for harsh environments, particularly automotive, military, aerospace, industrial and consumer avionics applications. Is compliant with UL746 and IPC-CC-830 requirements; is suited to application with non-atomized selective spray coating equipment.
The Quadris-3 quad-gantry model achieves a reported maximum throughput of 95,000 cph by maximizing SW sequences and minimizing delay times between motion sequences. Uses the same software and hardware as the Quadris-S, but with improved ease of use and maintenance. Handles components from 0201 to 44 x 44 mm, in tape and tray feeders including dual-track feeders. Transparent acryl cover on the top and side enhances visibility.
The ShareGen SPA 1000 Solder Paste Analyzer provides testing to control and manage solder paste in the production process. Is said to reduce a range of defects, including missing components, tombstoning, component misalignment, and non-wetting. Reportedly can perform up to six separate tests. Can be used to conduct solder paste open time testing.
The System 855A benchtop rework station’s profiling adjustments include push-button settings for temperature, airflow volume and duration. Unit proceeds automatically through three preheating zones and two reflow zones before auto shutoff. Up to 10 profiles can be stored in the memory. Has temperature range of up to 350°C. Includes external thermocouple on the PCB and an adjustable ceramic underheater. The production cycle begins as a heating nozzle is attached to the head, and then z-lowered onto the component. When reflow is complete, the head is automatically lifted, as solder residue is cleared.
Loctite 3508 cornerbond underfill material for BGA and CSP devices is a one-component epoxy that is pre-applied to the board at the corners of the CSP pad site using a standard dispensing system. Can be applied inline with existing capital equipment, with curing during the solder reflow process. Is Pb-free compatible and permits rework. Has a pot life greater than 30 days.