Flextronics to Use QFN Packages
Published: 21 June 2005
by Mike Buetow
"AIT's QFN package enables us to leverage power, footprint and performance that renders improved reliability while catering to the fast growing consumer electronics market," said Arnold Virrey, packaging manager at Flextronics.
AIT will also provide turnkey assembly, final test and tape and reel services for Flextronics.
The QFN package is said to provide superior thermal performance to leaded packages because of its exposed leadframe pad, which provides a direct path for removing heat from the package. QFN packages do not have gullwing leads which can act as antennae and create "noise" in high frequency applications.
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