SCHÄRDING and RADFELD, Austria -- EV Group, a supplier of wafer-bonding and lithography equipment, and Datacon Technology AG, a flip-chip and die bonding equipment supplier, announced a development, sales and marketing agreement for advanced-chip-to-wafer (AC2W) technology.

AC2W technology offers high device density through stacked devices, short interconnects and higher functional density. It enables the integration of various device technologies such as hybrid integration of IC and MEMS functionality.

The EVG540C2W chip-to-wafer bonder permanently bonds a wafer with single devices under defined process conditions, after they have been fixed with a temporary fixing agent in a high-precision flip-chip bonder from Datacon. The technology used for the bonding process is called face-to-face solid liquid interdiffusion, a technology that uses a metal soldering process.

"Our equipment allows a pre-bonding performance of up to 8500 chips per hour together with placement accuracy of 10µm@3s", said Helmut Rutterschmidt, president of Datacon Technology AG. "[We] can handle top chips as thin as 50 µm and wafers up to 300 mm diameter."

Developed in a joint R&D project, the new equipment platform has been successfully installed at Infineon AG, a major semiconductor device manufacturer.

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