Speedline’s Free Webcasts Continue with Final Product Quality Seminar
Franklin, MA, Oct. 12- Speedline Technologies' series of free monthly technical Webcast seminars exploring the challenges facing engineers in the semiconductor manufacturing
Process will continue this fall. Each seminar, hosted by industry experts, will share "knowledge in process" expertise, how-to insights, and include a Q&A session.
The next session, "Improving Final Product Quality," will take place Oct. 21 at 11 a.m. ET and again at 2 p.m. ET.
The seminar will cover:
o Cost and types of a defect.
o Impact of printing defects on first pass yield.
o Preventing defects.
o Inspection and test process planning.
o 2-D and 3-D solder paste inspection.
Future session includes "Reliable Underfill Dispensing," on Nov. 18 at 11 a.m. and 2 p.m. ET, and "Fine Pitch Printing Process," scheduled for Dec. 16 at 11 a.m. and 2 p.m. ET.
For more information, or to register, visit www.speedlinetech.com/seminars, or call (508) 541-4749.
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