FRANKLIN, MA, Sept. 20 -- Speedline Technologies has been awarded U.S. patent no. 6,738,505 for a texture-based method of analyzing potential bridge defects on circuit boards during post-print inspection.

The patent describes the use of so-called texture-based image acquisition algorithms and a digital camera to assess of the quality of paste deposits. The patent itself describes the method of using texture in the detection of paste in a region of interest between printed deposits.

Speedline markets the process as part of the MPM BridgeVision brand.

In a statement, Dr. Gerald Pham-Van-Diep, director of advanced development, said, "Prior to our innovation, manufacturers had to either rely on contrast-based methods, where the difference between the pasted deposit and soldermask was insufficient for repeatable or rapid measurement, or were compelled to purchase expensive 100% 3D AOI systems."

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