Universal Instruments (Binghamton, NY) is bolstering its high-speed chip placement offering with the introduction of the Quadris placement machine. The placer sets out to satisfy the demands of manufacturers who need very high placement rates, high productivity and reliable performance in placing small passives, larger leaded and area array packages or non-standard components.

The hybrid four-beam surface-mount placement system incorporates the advantages of turret-style and overhead gantry technologies. With dual-drive linear motors, it achieves 62,000 cph placement speed within a small footprint.

Reliable operation is achieved via proven turret technology. The machine places small surface-mount device passives and 0201s, while also addressing advanced packages including chip-scale packages (CSPs), ball grid arrays (BGAs), quad flat packs (QFP) and non-standard components with edge length up to 20 mm. 

The machine features automatic placement height optimization through on-the-head CCD linear sensors. Patented 12-spindle direct-drive heads have on-the-fly gang recognition. A board transfer system automatically centers the printed circuit board between feeder banks for optimal balancing across the beams. Bank feeder change and splicing capabilities facilitate rapid replenishment and product changeovers.

www.uic.com

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