Sanmina-SCI Corp. (San Jose, CA), a global electronics manufacturing services (EMS) company, and Agilent Technologies Inc. (Palo Alto, CA), have announced a new technique for rapidly generating high-resolution, sub-surface 3-D scans of complex multilayer backplane and printed circuit board assemblies (PCBAs).

Using Agilent's 5DX Series 5000 automated x-ray system, the new method verifies how well press-fit connectors with compliant pins are positioned within plated-through-hole (PTH) conduits. 

Featuring multilayer construction that can exceed 48 layers, Sanmina-SCI's backplanes deploy high-density, press-fit connectors into PTH conduits with diameters that often measure 0.022 in. and smaller.

Kent Dinkel, Agilent's Imaging marketing manager, Automated Test Group, said, "Our 5DX system was designed to be a powerful x-ray tester always looking for new problems to solve. We salute Sanmina-SCI for galvanizing an application that has enabled the industry's first sub-surface 3-D scans of complex backplanes in production environments." 

Dinkel also noted that press-fit connectors having compliant pins are becoming more widely used in a number of PCBA markets. 

Sanmina-SCI noted that when multiple component types, including surface-mount devices, populate a backplane or PCBA, the new inspection method can scan the entire backplane—both surface and sub-surface simultaneously—to check solder contacts of components as well as press-fit connector contact integrity.

www.sanmina-sci.com

www.agilent.com

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