Indium, Motorola Receive Soldertec Global Award
During a reception at Apex 2004, Soldertec Global awarded its Lead-Free Solder Co-operation Award to global solder materials manufacturer Indium Corp. and its customer Motorola.
The award recognizes the collaboration between the two companies. Indium's vice president of technology, Ning-Cheng Lee, and Motorola's Dr. Edwin Bradley and Dr. Vahid Goudarzi have developed a lead-free assembly process and solder paste that has been used to assemble more than 8 million cellular phones world-wide. The team shared their process details with the global electronics assembly industry.
The result of this co-operation is the Pb-Free Quickstart process, offering yields and benefits which are equal or better than similar processes using lead-bearing solders Benefits include a wide process window, component-friendly profiles and no requirement for nitrogen-reflow.
Several hundred process, quality and production engineers have been trained on the successful implementation of the process.
The Soldertec Global Lead-Free award, established in 1999, has been awarded to industrial consortiums, material suppliers and lead-free users from North America, Europe and Asia.
Copyright 2004, UP Media Group. All rights reserved.
Press Releases
- Critical Manufacturing Partners with Loftware to Deliver Seamless MES and Labeling Integration
- ViTrox Announces Exciting New Partnership with Hitronix Technology and Key Hire to Enhance Sales and Support Services in Brazil
- CE3S to Discuss Strategic Sourcing and Distribution Solutions at the SMTA Long Island Expo & Tech Forum
- KIC to Exhibit at Four SMTA Expo & Tech Forums in August