ENDICOTT, NY – Endicott Interconnect Technologies has received $49 million in followup orders from the U.S. Department of Defense for electronics packaging and substrates for high-end computing.
 
The program includes $5 million for electronics packaging R&D, EI said.
 
The contract is the first of a three-phased, five-year program that uses EI as a DoD research arm for exploring high-speed electronics technologies. Phase one includes system development and preliminary PCB and substrate design, along with fabrication of test vehicles for evaluating alternative material sets.
 
Phases two and three will address processing equipment for advanced technology, PCBs, substrates and assembly.
 
EI anticipates this will stimulate the recruitment of scientists and engineers to produce and deliver future technologies.

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