COLORADO SPRINGS, CO – A top stencil manufacturer has devised a process for eliminating wave soldering.
 
A recent paper authored by Photo Stencil vice president of technology Dr. Bill Coleman outlines a procedure called intrusive reflow, said to improve Pb-free material printing.
 
One objective of the study was to maximize the amount of solder paste printed into the through-hole. With proper squeegee speed and squeegee angle, 100% hole fill was achieved for 0.063"-thick boards and 85% hole fill for 0.093" -thick boards with a 0.006"-thick stencil. This reportedly resulted in good top and bottom fillets and continuous solder fill around the pins with a 0.006"-thick stencil for 0.063" and 0.093"-thick boards for resistors, DIPs and four-row header arrays.
 
X-rays of paste hole fill and cross-sections of through-hole pins after reflow are shown in the paper. To download the paper, visit www.photostencil.com/techpapers.htm. 
 
 

• Prev
• Next