FRANKLIN, MA – On July 19, Speedline will offer a free Webcast on stencil printing solder paste for the formation of solder bumps. 

This Webinar will review all aspects of the bump printing process including stencil design, solder paste selection, fixturing and printing parameters. In addition, optimization of the related reflow soldering process will be discussed. 

The one-hour presentation will start at 11:00 am EST. 

To register, go to www.speedlinetech.com/seminars.