BINGHAMTON, NY – The Unovis Solutions Area Array Consortium gathered in June for a detailed review of this year’s research tracks.

Progress reports were presented on efforts to understand the complex microstructures of Pb-free solder joints and their impact on reliability. Issues pertaining to the reliability of printed circuit materials and designs, as well as QFN and FCBGA assembly and underfilling, were also discussed.

More than 80 attendees from 30 member companies and institutions joined in the two-day workshop.

Led by Dr. Peter Borgesen, the advanced electronic assembly research consortium, formerly run under Universal Instruments, tackles materials and microstructure-related reliability issues critical to high-quality electronics assembly.
 
Members can join the consortium any time and have access to the body of knowledge amassed through its efforts during the past 15 years.

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