FRANKLIN, MA – Speedline Technologies will present a Webcast on reduction/elimination of two common SMT defects: tombstoning and mid-chip solder balls. The one-hour presentation takes place Aug. 16 at 11 a.m. EDT. 

The Webinar will review some of the studies and experiments conducted to determine and eliminate the causes of tombstoning. Specific areas of analysis will include solderability, paste volume, placement issues, and pad surface area/design criteria.

Topics to be reviewed in discussing mid-chip solder ball elimination will include stencil design, board design, reflow profile development, component placement accuracy, and solder paste printing. 

To register, visit www.speedlinetech.com/seminars.
 

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