HERNDON, VA and PISCATAWAY, NJ —The International Electronics Manufacturing Initiative (iNEMI), will co-sponsor the third annual Tin Whisker Workshop with the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) and the Electronic Components and Technology Conference (ECTC).  The workshop is scheduled for May 30, at ECTC in San Diego.
 
The workshop will provide an update on recent activities in the testing and modeling of tin whiskers. A roundtable discussion will focus on implementation of the JEDEC/IPC specifications relating to tin whiskers: JESD201, “Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes;” JEDEC/IPC joint publication JP002, “Current Tin Whiskers Theory and Mitigation Practices Guideline;” and JESD22A121, “Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes.” The workshop aims to identify strategies to assure that long lifecycle applications will not be subject to tin whisker failures.
 
For additional info, visit: inemi.org/cms/calendar/06_ECTC_TW_Workshop.html

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