CLINTON, NY – More than 40 technicians and applications engineers attended Indium Corp.’ s 4th Annual Global Technical Summit in September.  Attendees from Asia, Europe, Mexico, and the U.S. learned about new products, current research, and breakthrough developments, and presented case studies.

The agenda included presentations by Dr. Claudius Ferger, manager of advanced plastic packaging at IBM’s Thomas J. Watson Research Center; Indium vice president of technology Dr. Ning-Cheng Lee and senior technologist Dr. Ronald C. Lasky.